Used AMAT / APPLIED MATERIALS Centura DPN #9176407 for sale

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ID: 9176407
Wafer Size: 12"
Vintage: 2008
Etcher,12" (1) DPN Chamber (1) Chiller power rack box Software OS: Windows 2003 Lot capability: 400 Process speed per unit time: Mechanical throughput: 200 / Hour Clock bandwidth: 60 Hz Frequency: 60 Hz Power requirements: AC 208V 60 Hz 250 A 2008 vintage.
AMAT / APPLIED MATERIALS Centura DPN is a low-pressure a.c. bottom-load deposition/etching reaction chamber engineered to perform a variety of deposition and etching processes in semiconductor and integrated circuit fabrication. The membrane-covered quartz reaction chamber is equipped with three voltage peaking 14 KV power supplies enabling two types of plasma generation. These two plasma modes are the conventional inductively-coupled plasma mode (ICP) and the direct-coupled plasma mode (DCP). The structural design of AMAT Centura DPN provides excellent uniformity and excellent load to unload repeatability. The chamber is designed to minimize occurrences of particles, effluents, and increase reliability. A digital pressure controller and ancillary equipment, which is mechanical in nature, are included as standard. The chamber design also allows easy access to the substrate during all substrate transfer operations and all maintenance operations due to the built-in maintenance console. APPLIED MATERIALS CENTURA (DPN) features two different types of gas sources: a unified gas and a discrete gas supply. The unified gas supply uses RegAuto valves which provide excellent repeatability and minimal process drift for all gases regardless of the substrate. The discrete gas supply provides precise control of all sources inputs and provides a wide dynamic range of reaction possibilities. AMAT CENTURA (DPN) provides the users optimal control of all process inputs (gas flows, RF powers, substrate temperature, pressure, etc). Furthermore, the system has a self-diagnostics software that monitors the health of the system and identifies any failure before it becomes a process issue. Centura DPN is capable of performing a wide variety of etching and deposition processes, including BOE (buffered oxide etch), isotropic etch, BOE-etch, RIE (reactive ion etch), and CVD (chemistry vapor deposition). The included software package provides users with easy-to-use control and automation capabilities, allowing for complex recipes and fast time to results. In conclusion, CENTURA (DPN) reactor offers a user-friendly, reliable, and precise system for etch and deposition processes for semiconductor and integrated circuit fabrication. Offering reliable repeatability and exceptional uniformity, AMAT / APPLIED MATERIALS CENTURA (DPN) enables customers to achieve optimum control of their process parameters and obtain the desired results.
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