Used AMAT / APPLIED MATERIALS Centura DPN #9399901 for sale

AMAT / APPLIED MATERIALS Centura DPN is a high-performance integrated Etch/Deposition Reactor Equipment combining the latest advances in etch and deposition technologies Accessible through a single platform. This enables engineers to create highly customized structures such as multi-dielectric dual-dielectric films, MEMS (Micro Electro-Mechanical Systems) devices, ultra-low k dielectric films and optical waveguides. The system is specially designed for high-volume, high-performance environment and is suitable for a wide range of applications such as memory and logic devices, 3-D integrated circuit assemblies, power amplifiers, integrated display circuits and optical transducers. The centrifugal pump of AMAT Centura DPN can accommodate the highest precision materials with the lowest risk of degradation from impurities. The unit features a unique shutter-based loading machine that can load multiple etch/deposition materials and switching between them for optimal process performance. APPLIED MATERIALS CENTURA (DPN) includes four mount locations enabling the user to have precise control over where the materials are loaded and unloaded for precise dosing of the target etch/deposition parameters. The tool is capable of providing precise reactive ion etching (RIE) of various materials up to 10 μm. The asset features real-time RIE pressure feedback, allowing precise control of EBSD parameters throughout the entire process, precise temperature control of etching gas, precise control of temperature uniformity across the substrate, and precise control of etching and deposition by-products. CENTURA (DPN) also enables simultaneous use of two different etch/deposition gases, thus allowing precise control over the final etch/deposition characteristics of the final film. Other features of Centura DPN include an easy-to-use graphical interface enabling precise control over the entire process, and model performance monitoring to ensure optimum performance under all etch/deposition conditions. The equipment is equipped with high-performance multivariate analysis for precise control of growth, refractory and cap layer parameters. APPLIED MATERIALS Centura DPN provides complete control over the entire deposition and etching process from loading and unloading of the materials to complete control of the material etch/deposition parameters and post processing. Finally, the system is capable of automated several etch and deposition processes, eliminating the need for operators to switch and mix material etch/deposition conditions.