Used AMAT / APPLIED MATERIALS Centura DPS G5 #9379814 for sale

AMAT / APPLIED MATERIALS Centura DPS G5
ID: 9379814
Wafer Size: 12"
Etcher, 12" (3) Mesa chambers Axiom chamber.
AMAT / APPLIED MATERIALS Centura DPS G5 is an ultima-performance 300 mm silicon wafer family reactor designed to enable the most advanced device structures. It is used to process materials such as polysilicon, and oxides, nitrides and silicides at higher temperature up to 800oC. AMAT Centura DPS G5 features optimized wafer through-put when compared with any other reactors. It is equipped with Digital Process Control (DPC) technology which allows high repeatability accuracy with digital control to stabilize the chamber environment. AMAT Centura also boasts fast ramping capabilities to minimize thermal budgets and improve process repeatability and de-gas times. APPLIED MATERIALS Centura DPS G5 offers atomized activated plasma that is used to reduce the oxides and nitrides to their catalytic form for CVD integration. This feature allows the reactor to achieve enhanced production line performance through highly uniform process gas distribution, quick response time and precise control of film thickness. The reactor has a direct-drive linear actuator which leads to higher accuracy and repeatability for advanced bilayer layer deposition processes. These reactions also have superior purge control by using a rapid-response RF/plasma series. Centura DPS G5 has a two-substrate heater option, which allows high temperature and high-pressure reaction for an extended number of wafers. It also has a quartz or boron nitride susceptor featuring DDR load/unload to reduce reverse migration and air exposure of wafers. It is equipped with process recipe control functions which guarantee process repeatability, uniformity, and reproducibility. Also enables optimizable wafer-to-wafer distribution and process performance, with superior process quality. Overall, AMAT / APPLIED MATERIALS Centura DPS G5 is a reliable advanced deposition system that is ideal for manufacturing of high-performance advanced ICs, as well as semiconductor device structures. Its sophisticated design and various programmable features make it one of the most advanced deposition systems in the industry today.
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