Used AMAT / APPLIED MATERIALS Centura DPS II #293705866 for sale

AMAT / APPLIED MATERIALS Centura DPS II
ID: 293705866
Vintage: 2010
Poly etchers 2010 vintage.
AMAT / APPLIED MATERIALS Centura DPS II is a single-wafer, ultrahigh-vacuum (UHV) deposition equipment designed to process high-performance integrated circuits. The system is optimized for cost-effective production, providing a fast cycle time and high throughput rates with minimal operating costs. It offers a suite of process modules, including electron cyclotron resonance (ECR) plasma source, remote inductively-coupled and ECR plasmas (RCP/ECP), and remote source gas injection (RSGI) with integrated swirl injector. AMAT Centura DPS II UHV deposition unit is designed for low-cost, high-volume production of advanced semiconductor devices and is capable of achieving deposition rates of up to 1nm/s for nitrided titanium, tantalum, and other materials. The machine is highly configurable, allowing for up to two sources of ionized particles to be added to the process. The tool can accommodate a variety of substrate sizes from 0.25" to 8" and individual process parameters can be adjusted to optimize process performance for specific metal-oxide, dielectric and barrier materials. The asset also features a process control model (PCS) designed for rapid process development and process optimization. The PCS is optimized with a real-time process data collection equipment that acquires data directly at various points in the process to ensure product consistency and reliability. This allows for immediate process optimization and adjustment of process parameters with no downtime. APPLIED MATERIALS CENTURA DPS+ II is equipped with the latest technology, and includes a high-resolution four-pocket selectable single-wafer transfer robot, full-range computer process control, and a dynamic process window. The Multi-Stage Modulator (MSM) system enables independent source gas control throughout the deposition process. It also offers up to four sources of plasma to enable deposition of a variety of materials with simultaneous remote plasma surface treatments for advanced device structures. AMAT CENTURA DPS+ II is designed to deliver high throughput and excellent process control, enabling manufacturers to deliver the highest level of process quality and efficiency at the lowest cost per unit. This unit offers the ultimate solution for single-wafer process development, from research and development to high-volume production in the most cost-effective manner, allowing for faster and more efficient fabrication of advanced semiconductor devices.
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