Used AMAT / APPLIED MATERIALS Centura DPS II #293705867 for sale

AMAT / APPLIED MATERIALS Centura DPS II
ID: 293705867
Vintage: 2006
Poly etchers 2006 vintage.
AMAT / APPLIED MATERIALS Centura DPS II is a plasma-enhanced chemical vapor deposition (PECVD) reactor used in the semiconductor industry for the deposition of films and layers with precise control over uniformity and conformality. The DPS II reactor utilizes radiofrequency (RF) excitation and microwave plasma generation to precisely control the deposition rate, conformality, and uniformity. This allows for a wide variety of semiconductor applications, including advanced device structures such as transistors, RAM, and interconnects. The DPS II reactor consists of a sealed chamber that houses an end-mounted gas-distribution system. The end-mounted gas-distribution system consists of gas injection ports, exhaust ports, and heaters. Gases are injected into the chamber through the gas injection ports and are evenly distributed throughout the chamber by a series of baffles. The combination of RF and microwave power is supplied to the gas-filled chamber to generate a high-density plasma which is used to deposit the desired film or layer onto the process wafer. The DPS II reactor also features a Bias Point Generator. This device provides an adjustable DC bias voltage that can be adjusted to control the profile and uniformity of deposition on the wafer. Additionally, a pressure control valve is used to adjust the chamber pressure for optimal deposition. The DPS II provides excellent process control and uniformity with its advanced RF, microwave, and bias-point generator technologies. It can be used to deposit films and layers for a wide variety of advanced semiconductor structures. The end-mounted gas-distribution system also ensures uniformity of deposition. All of these features combine to make the DPS II an excellent choice for advanced semiconductor deposition processes.
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