Used AMAT / APPLIED MATERIALS Centura DPS II #9293611 for sale

AMAT / APPLIED MATERIALS Centura DPS II is an advanced plasma Enhanced Chemical Vapor Deposition (E-CVD) reactor used in the semiconductor and microelectronics industries. The DPS II is capable of processing complex thin film stacks on wafers up to 8 inches in diameter. The reactor is designed with robust hardware for excellent power and deposition uniformity, and is ideal for both low and high rate deposition processes. The DPS II offers advanced features like a quartz top-liner, a patented sidewall liner which enables fast cleaning cycles and long run times, and a sealed chamber which helps minimize contamination and ensures reproducible results. The reactor also includes programmable gas staging and enhanced real-time tunability for ultimate process control. Its automatic end-point detection provides precise control for processes such as Multi-Stack Film deposition. AMAT Centura DPS II has a wide range of process capabilities, ranging from low-temperature Nitride deposition for PMOS devices to high-temperature CVD Oxide for NMOS devices in memory and logic VLSI technologies. The system also has the flexibility to deposit conformal films without the use of auxiliary assistance, making it suitable for deposition of high-quality barrier and protective films. Being part of AMAT Centura platform, the DPS II also has enhanced safety and environmental features. It is equipped with automated safety zone systems that sense potential leak risk based on the gas composition, pressure and temperature and shut the system down automatically if needed. This reactor also features a modular design for easy upgrades and maintenance, efficient gas cycling, and automatic venting which eliminates the need to manually clean or evacuate the chamber. In conclusion, APPLIED MATERIALS CENTURA DPS+ II is an advanced and reliable E-CVD reactor offering excellent power and deposition uniformity with programmable gas staging. Its advanced hardware and safety features make it an ideal choice for a variety of deposition processes.