Used AMAT / APPLIED MATERIALS Centura DPS II #9390587 for sale
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AMAT / APPLIED MATERIALS Centura DPS II is an upgraded version of the earlier Centura DPS, and is a tool used for low pressure Chemical Vapor Deposition (CVD) and Low Pressure Metal Organic Chemical Vapor Deposition (MOCVD). It is designed to meet the demands of advanced integrated circuit (IC) production. It enables the deposition of thin film layers of materials onto a substrate in a controlled and efficient manner and is used to produce IC's with enhanced performance. AMAT Centura DPS II is the latest in a long line of AMAT deposition tools. The system is designed to provide unparalleled uniformity and predictability for semiconductor device production. The tool utilizes electron cyclotron resonance (ECR) microwave plasma source to enable low-pressure CVD and MOCVD production. The ECR source provides low pressure and high power density for excellent uniformity over large substrates. The plasma plume is optimized for maximum conformal re-deposition of all materials, with minimal disruption of surface conditions on the substrate and high productivity. The tool is available with a range of accessories for manual or automated substrate loading and unloading. It can be configured for hot or cold substrate transfer, depending on the application. The high speed, precision transfer capabilities allow for efficient production of high quality thin films. The tool is also equipped with advanced sensors for real-time monitoring of process parameters. The monitoring system is highly precise and provides operators with precise understanding of the current production status. APPLIED MATERIALS CENTURA DPS+ II is an advanced tool that is designed to provide superior production of advanced integrated circuits in low pressure CVD and MOCVD processes. It is capable of precise process control and uniformity across large substrates. With advanced real-time monitoring of process parameters and efficient transfer capabilities, operators are able to produce high quality thin films with excellent yields. This tool is ideal for a production environment that requires high precision and uniformity production in low pressure CVD and MOCVD processes.
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