Used AMAT / APPLIED MATERIALS Centura DPS Poly #9226614 for sale

AMAT / APPLIED MATERIALS Centura DPS Poly is a dry-patched, vertical thermal chemical vapor deposition reactor developed for the deposition of polycrystalline silicon and other materials. The Centura DPS™ Poly platform combines vertical and horizontal processing capabilities with a piston-driven rotational time control to deliver Nanosecond Control™ of the vertical thermal deposition process. The Nanosecond Control™ equipment is capable of controlling the substrate temperature within a range of 1°C, ensuring the deposition of high-quality polycrystalline silicon films. The vertical process geometry of the Centura DPS™ Poly platform also provides outstanding access for manual cleaning and maintenance. The versatile Centura DPS™ Poly platform features a small footprint and low utilities consumption, making it ideal for semiconductor fabrication facilities. The Centura DPS™ Poly platform is also capable of operating with an advanced process automation system, allowing it to be integrated into automated tool flows. The platform utilizes a unique dual source unit, providing even distribution of reactant gases and excellent uniformity across substrates and wafer sizes, resulting in high quality films at a high substrate throughput rate. The Centura DPS™ Poly is thoroughly tested to ensure that all components and systems operate correctly and meet the high standards of the industry. Each machine undergoes a rigorous calibration and validation process to ensure optimum processing capability. The tool can be equipped with an INOVA Module™ to provide additional control and monitoring capabilities, decreasing the need for module swapping and boosting operational uptime. In conclusion, AMAT Centura DPS™ Poly is an excellent choice for the deposition of high-quality polycrystalline films. The vertical process geometry and Nanosecond Control™ asset enable outstanding process stability and excellent access for cleaning and maintenance. The model also features a small footprint and low utilities consumption, making it a great choice for semiconductor fabrication facilities with limited space. The dual-source equipment ensures even reactant gas distribution, improving film uniformity and throughput rates.