Used AMAT / APPLIED MATERIALS Centura DPS #9212912 for sale

ID: 9212912
Wafer Size: 8"-12"
Poly / Metal etcher, 8"-12".
AMAT / APPLIED MATERIALS Centura DPS (Deposition Process Equipment) is a highly versatile and reliable UHV (ultra-high vacuum) process tool used for the deposition of thin film materials onto semiconductor and flat panel display substrates. The system has been specially designed for the production of high-purity, ultra-thin layers of process materials with excellent uniformity and uniformity control capabilities, enabling sophisticated deposition processes to be produced. The unit utilizes two independent deposition sources along with two independent gas sources. The machine has been designed to achieve very low particulate levels, making it highly suitable for the production of ultra-thin layers. AMAT Centura DPS operates using several process components, including a vacuum process chamber, deposition source, gas source, write source, target shield, temperature source, and a source of ultra-high vacuum (UHV). The vacuum process chamber is a continuous vertical tube structure, which enables sustained ultra-high vacuum conditions and helps eliminate the possibility of particle escape into the machine environment. The deposition source is an electron-beam evaporation tool designed to reduce the effects of droplets and uniformity in the film structures deposited onto the substrate material. The gas sources are used to introduce a predetermined gas pressure to the process chamber, and can also be used to monitor and control the process. The write source is used for the delivery of the process recipe and the target shield enables spatial control of the photon energies used in the deposition processes. APPLIED MATERIALS Centura DPS is highly effective for the deposition of complex multi-layer structures, due to its precise control over both the deposition sources and the gas sources. It is capable of producing layers as thin as 10 nanometers with excellent uniformity control capabilities. The deposition process is highly repeatable, thanks to its ultra-high vacuum configuration and its precise temperature control. The asset is equipped with extensive data logging and process control, allowing the user to monitor and adjust process parameters in real time. Centura DPS is an exceptionally reliable, ultra-high vacuum process tool that is highly recommended for the production of ultra-thin film layers with precise uniformity control. Its precise temperature control and advanced data logging capabilities make it ideal for complex multi-layer processes, while its UHV configuration provides a high degree of repeatability and controllable processes. This makes it an ideal choice for substrate deposition and thin film applications.
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