Used AMAT / APPLIED MATERIALS Centura DPS+ #9233287 for sale
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ID: 9233287
Wafer Size: 8"
Vintage: 2000
Metal etcher, 8"
Mainframe: Centura Phase2
Chamber A & B:
DTCU: EDTCU
Gate & throttle valve: Pentium & throttle valve, VAT
EDWARDS STP-H1303C Turbo pump
Pumping tube: Heated
ENI QMW-25 Generator (Source)
ENI OEM-12B Generator (Bias)
ESC: Ceramic
EPD: Monochromator
Chamber C&D (ASP+):
ASTEX AX-2115 Microwave generator
Tuner: Auto tuner
Chamber E: Fast cooldown
Chamber F: Orieter
Xfer: VHP Robot
L/L: Narrow tilt-out
Gas panel:
Chamber A & B:
Gas / Size / Model
N2 / 20sccm / 8160
O2 / 500sccm / 8160
Ar / 200sccm / 8160
CHF3 / 20sccm / 8160
SF6 / 200sccm / 8160
BCL3 / 100sccm / 8160
CL2 / 200sccm / 8161
Chamber C & D
Gas / Size / Model
N2 / 500sccm / 8160
O2 / 5000sccm / 8160
N2 / 1000sccm / 8160
VDS
Missing parts:
Process chamber chiller & hose
EPD Monitor rack
2000 vintage.
AMAT / APPLIED MATERIALS Centura DPS+ is an advanced plasma-enhanced chemical vapor deposition (PECVD) equipment designed to meet the demands of next-generation OLED displays and other microelectronics applications. AMAT Centura DPS+ provides a selection of chambers to suit any deposition requirements, with a Delta chamber designed for the deposition of basic cells, a sigma chamber designed for compound semiconductor deposition, and a Stripe chamber designed for depositing rectifying films with stripe-shaped targets. This allows for a broad range of deposition capability, from ultra-thin films to films over two millimeters thick. The apparatus comes with many features to improve processing speeds and yields, such as multiple process control capabilities, including temperature control using ultra-precision control systems, micron-level uniformity and repeatability, real-time automated load-locking, variable-frequency RF sputter power supplies, and customizable end-point detection. In addition, the system operates semi-automatically and can be programmed accordingly to process wafers in a variety of shapes and sizes. It features low-temperature processing, and plasma-activated gas discharges enhance deposition rate, uniformity, and quality. The high-purity process gases used in the unit offer excellent film uniformity and process stability. APPLIED MATERIALS CENTURA DPS+ also offers exceptional plasma control with fully adjustable power and pressure levels, allowing users to fine-tune process parameters to achieve optimal material performance. Special multi-chamber clustering architectures enable high-throughput cluster processing. Furthermore, high-precision integrated alignment fixtures and automatic wafer loading platforms minimize manual labour. Overall, AMAT / APPLIED MATERIALS CENTURA DPS+ offers advanced processing capabilities for next-generation OLED display deposition and other microelectronics needs. With its range of features, the machine offers an efficient and reliable platform for deposition and etching requirements.
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