Used AMAT / APPLIED MATERIALS Centura DPS+ #9251499 for sale

AMAT / APPLIED MATERIALS Centura DPS+ is a leading-edge high-density plasma etch process reactor designed to provide ultra-high etching efficiency, high throughput and improved process flow. AMAT Centura DPS+ combines breakthrough etch technologies and breakthrough low-cost consumable consumables to provide a cost-effective, consistent, high-quality etching solution to both small and large semiconductor and MEMS device fabrication plants. APPLIED MATERIALS CENTURA DPS+ uses a combination of multiple etch technologies including Dual Frequency High Density Plasma (HDP), isotropic etching and low-pressure chemical vapor deposition (LPCVD). This combination of technologies allows for improved and economical etch processes in a wide variety of applications such as thin film etch, deep and shallow trench etch, selective device layer isolation, interconnect isolation, and multilayer etch, among others. The patented HDP technology provides the highest etch rate available with no "undercutting" or distortion of the underlying substrate layer. The HDP technology can be used for both isotropic etching and anisotropic etching providing high etch rates for both. This etching technique is particularly suitable for the etching of ultra thin, highly delicate, and/or extremely conformal layers. The integrated low-pressure chemical vapor deposition (LPCVD) technology can provide both selective and uniform chemical etch processes. The unique real-time feedback system of the LPCVD process ensures optimal deposition at every stage of the process and provides improved production yields and device performance. The LPCVD process also offers a wide variety of rates, selectivity and stoichiometry, allowing for the production of custom engineering materials with tailored properties. AMAT / APPLIED MATERIALS CENTURA DPS+'s platform flexibility is further enhanced by its three modes of operation. These include an automatic production mode, a semi-automatic selection mode, and a manual-expert selection mode. The three mode setting allows etchers to optimize the process conditions and performance to the specific application or task at hand. Protected by U.S. Patents, APPLIED MATERIALS Centura DPS+ offers a unique solution to plasma etching needs. With its combination of advanced process flow, multiple etch technologies, and flexible platform, CENTURA DPS+ provides a cost effective, consistent, and high-quality etch process for a wide range of device fabrication needs.