Used AMAT / APPLIED MATERIALS Centura DPS+ #9251502 for sale

AMAT / APPLIED MATERIALS Centura DPS+ is a semiconductor reactor developed by AMAT for advanced processing applications. AMAT Centura DPS+ is an advanced multi-substrate diffusion and implant reactor that provides the capability to rapidly deposit and etch doped films on multiple substrates in a single process tool, through a high-speed sequential substrate transfer. This makes the equipment ideal for utilization in high-volume production of high-density, ultra-large-scale integration (ULSI) components. Additionally, APPLIED MATERIALS CENTURA DPS+ reactor also supports advanced material deposition techniques, like low-pressure chemical vapor deposition (LPCVD) as well as MOL (Metal Oxide Low Temperature) processes. APPLIED MATERIALS Centura DPS+ reactor is an automated, fully automated multiple wafer system consisting of multiple modules, each designed to handle specific processing phases. These include the Purge/Gass Flow Module, the Wafer-Transfer Module, the Thermal Chamber, the Gas Delivery Module, the Cold Wall Module, and the Hot Resource Module. The Purge/Gas Flow Module of CENTURA DPS+ reactor ensures reliable and consistent gas flows by automatically controlling and maintaining gas-flow rates to meet specific requirements. This module also manages and controls the necessary electronics and mechanics required to properly purge the reactor chamber and its processes. The Wafer-Transfer Module of AMAT CENTURA DPS+ reactor enables efficient and accurate transfer of multiple substrates into the Thermal Chamber. This module is extremely important for the accuracy and efficiency of AMAT / APPLIED MATERIALS CENTURA DPS+ unit, as it accelerates the overall production process. The Thermal Chamber of Centura DPS+ reactor is constructed from 316L stainless steel and is engineered to deliver a temperature range of up to 1200 degrees Celsius for advanced processing needs. The controllable temperature enables the Chamber to accurately apply processing profiles to different substrates, ensuring perfect accuracy and precision when depositing or etching materials. The Gas Delivery Module of AMAT / APPLIED MATERIALS Centura DPS+ reactor allows the process gases required by the machine to be delivered accurately and precisely. This module is also responsible for routing, controlling, and managing gas flows required by the reactor. The Cold Wall Module of AMAT Centura DPS+ reactor allows Cryo-Cooling, or cryogenic cooling, to be accurately and precisely applied to the substrate, allowing extremely accurate and repeatable temperature control. Finally, the Hot Resource Module of APPLIED MATERIALS CENTURA DPS+ reactor manages and controls essential resources, such as power and heating elements, to the Thermal Chamber for accurate and repeatable processing. Additionally, this module also allows for accurate automatic adjustment of the temperature to meet specific requirements. Altogether, these modules allow APPLIED MATERIALS Centura DPS+ reactor to accurately and precisely deposit and etch materials, providing high-volume fabrication of high-density, ultra-large-scale integration (ULSI) components. The advanced technology provided by APPLIED MATERIALS ensures reliable and repeatable performance, enabling the highest level of precision in the semiconductor industry.