Used AMAT / APPLIED MATERIALS Centura DxZ #9174380 for sale
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ID: 9174380
Wafer Size: 8"
Vintage: 1996
CVD Nitride system, 8"
Process: DCVD
Wafer specification:
Wafer shape: Notch
SMIF Interface: None
System information:
Chamber A
Chamber B
Chamber D
Chamber E (MS COOL)
Chamber type:
Chamber A: DxZ
Chamber B: DxZ
Chamber C: DxZ
Chamber A:
Manometer: 100/2
Heater: AL
Clean method: AE 2000-2V
Pressure method: Direct drive throttle valve
Chamber B:
Manometer: 100/2
Heater: AL
Clean method: AE 2000-2V
Pressure method: Direct drive throttle valve
Chamber D:
Manometer: 100/2
Heater: AL
Clean method: AE 2000-2V
Pressure method: Direct drive throttle valve
System monitor:
Monitor 1: Through the wall
Monitor 2: Stand alone
Mainframe information:
Loadlock: Narrow body
Robot type: HP
OTF: Yes
Gas delivery option:
MFC Type: Unit MFCs
Filters: Millipore
Regulators: Veriflo
Single line drop (SLD): Yes
System cabinet exhaust: Top
Gas pallet configuration:
Chamber A Size Model
SiH4 500sccm Stec MFCs
NH3 200sccm Unit MFCs
NF3 1 Slm Unit MFCs
N2O 500sccm Unit MFCs
N2 5 Slm Unit MFCs
Chamber B Size Model
SiH4 500sccm Stec MFCs
NH3 200sccm Unit MFCs
NF3 2 slm Unit MFCs
N2O 500sccm Unit MFCs
N2 5 Slm Unit MFCs
Chamber D Size Model
SiH4 500sccm Stec MFCs
NH3 200sccm Unit MFCs
NF3 1 Slm Unit MFCs
N2O 500sccm Unit MFCs
N2 5 Slm Unit MFCs
1996 vintage.
AMAT / APPLIED MATERIALS Centura DxZ is a highly specialized, high-temperature reactor designed for the advanced manufacture of compound semiconductor devices. This fully automated CVD equipment simultaneously processes wafers in a single chamber with the ability to process production run quantities of up to 200 wafers. The reactor offers a range of furnace temperatures for greater flexibility in programming and otherwise managing uniform deposition processes. Its exceptional temperature uniformity from edge-to-edge and from top-to-bottom surface of the substrate allows for improved consistency in device fabrication. The system is equipped with an array of advanced features and capabilities, including a Quartz Crystal Microbalance (QCM) monitor, a quartz reflectance monitor, an O-ring seal design, gas handling features and a wafer carrier unit. The QCM monitor provides real-time deposition and growth rate information, while the quartz reflectance monitor helps ensure uniformity of film thickness during deposition. The O-ring seal assists with the efficient and controlled process of introducing the necessary gases into the reaction chamber, while the gas handling features allow the reactor to maintain ideal gas concentration ratios. Finally, the integrated wafer carrier machine ensures that wafers remain immobile during the deposition process. The powerful AMAT Centura DxZ plasma tool supplies five PVT alternative modules for a wide range of applications, including thermal oxidation, dry etching and plasma enhanced deposition. Its advanced Advanced Glove Box Gas Mixing capability enables precise control over the delivered gases, including their flow rate and concentration levels. With its high-pressure operation, unequalled temperature uniformity, and its ability to process a wide range of wafer sizes, the asset is ideal for producing a variety of advanced semiconductor devices. Perfect for the demanding needs of compound semiconductor device fabrication, APPLIED MATERIALS Centura DxZ features state-of-the-art hardware engineering, a robust design, and a range of advanced process options. This world-class reactor is capable of reliably and consistently producing excellent quality compound semiconductor devices, while saving time and resources for manufacturers and developers alike.
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