Used AMAT / APPLIED MATERIALS Centura eMax CT+ #293633129 for sale

AMAT / APPLIED MATERIALS Centura eMax CT+ is a next-generation plasma etch reactor designed for advanced semiconductor engineering. This innovative solution has been engineered to provide superior performance for superior process yields and repeatability. The eMax CT+ reactor features a unique patented design that combines proven high-efficiency inductively coupled plasma (ICP) technology with innovative detector and operability enhancements to enable top-of-the-line process control. This combination of powerful features makes the eMax CT+ a highly reliable and efficient tool for nanofabrication. The eMax CT+ reactor features an advanced wafer orientation equipment, which provides precise alignment for both wafers in the etch chamber. This allows for the production of high-resolution patterns with an incredibly small feature size. The eMax CT+ also incorporates a variable chamber pressure system to enable the adjustment of gas pressure in the unit, ensuring accurate and repeatable process results. The reactor also utilizes a rapid-response quartz crystal monitor to enable process monitoring and optimization in real time. The eMax CT+ also features an advanced gas delivery machine with volumetric adjustment to optimize process parameters and enable quick and iterative exploration of process recipes. The reactor also utilizes a sophisticated recipe-management software to enable dynamic alteration of process parameters. For maximum productivity, the eMax CT+ reactor also offers multi-cassette loading capabilities as well as low-load-level monitoring and control. The eMax CT+ also features an advanced cooling tool incorporating carefully optimized liquid-cooling systems and variable-speed fans to provide reliable and consistent process stability. The powerful cooling asset also enables more effective and accurate temperature control in the chamber, allowing for more precise and repeatable processes in the etch chamber. The eMax CT+ reactor is designed to be an incredibly versatile tool capable of handling a wide range of substrate materials, such as tungsten, titanium, aluminum, and titanium nitride, enabling a wide range of process applications. The model can handle up to 6 inch wafer substrates with a maximum process rate of 600 nm/min, delivering top-of-the-line performance for advanced semiconductor engineering.