Used AMAT / APPLIED MATERIALS CENTURA ENABLER E2 #9235111 for sale

AMAT / APPLIED MATERIALS CENTURA ENABLER E2
ID: 9235111
Wafer Size: 12"
Vintage: 2009
Etcher, 12" 2009 vintage.
AMAT / APPLIED MATERIALS CENTURA ENABLER E2 is a next-generation multi-chamber dry etch reactor. It is ideal for cost-effective production of advanced device structures and is well-suited for MEMS, RF, power semiconductor, and advanced packaging applications. AMAT CENTURA ENABLER E2 has a modular design that can provide high-throughput RF plasma etch, deep etch, and time-of-flight etch capabilities in a single compact equipment. It features two independently-controlled source chambers and one plasma chamber. The chambers can be optimally configured to process different materials and structures. The source chambers feature RF excitation with independent power control, allowing large-area etching of dielectric and hard to etch materials. The RF power is adjustable in 20kHz steps up to 500W, and can be applied over an area of greater than 6 inches in diameter. The source chambers also include convenience features like wafer location mapping and gamma-ray assisted wafer loading for improved recipe transfer and precise etch control. The plasma chamber offers deep etch with reactive and inert-gas chemistry, enabling easy topography and feature optimization. The etch rate is adjustable between 0.5 and 500nm/min, and the chamber also supports substrate temperature control of up to 1000°C. The chamber further includes both inductively and electron-cyclotron-resonance excitation modes, as well as an advanced induction coil for optimal spatial current distribution. APPLIED MATERIALS CENTURA ENABLER_E2 includes a built-in pumped-down load lock with a fast-pollution recovery system. The load lock maintains ultra-low vacuum between wafer loading to reduce loading and unloading times. Additionally, the load lock includes an active cooled bake unit, which allows for shorter bake times without compromising on quality. Overall, AMAT CENTURA ENABLER_E2 is an advanced, multi-chamber etch reactor that allows for a variety of production processes in a single compact machine. It offers high-performance etching capabilities, and is ideal for production of MEMS, RF, power semiconductor, and advanced packaging technologies. The reliable performance and cost-effectiveness of this tool make it a reliable choice for many applications.
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