Used AMAT / APPLIED MATERIALS CENTURA ENABLER E2 #9281495 for sale

AMAT / APPLIED MATERIALS CENTURA ENABLER E2
ID: 9281495
Etcher.
AMAT / APPLIED MATERIALS CENTURA ENABLER E2 is a market-leading high density plasma oxide etch reactor for advanced device manufacturing. It delivers high throughput, process uniformity, and contamination control, enabling superior device performance and reliability. Specifically, the Enabler E2 is an inductively-coupled plasma (ICP) etch reactor featuring a proprietary design that allows it to produce a high-density uniform plasma to etch deep within feature geometries. Additionally, this equipment contains a unique etch chamber capable of delivering the high-density plasma necessary for etching of high aspect ratio features, making it well-suited for fabrication of extremely small and complex structures. This chamber is equipped with up to four sources of electromagnetically-driven reactive gases, providing users with the ability to fine-tune processes for any application. AMAT CENTURA ENABLER E2 also comes equipped with a closed-loadlock system to minimize particle and contamination levels. It provides a fast, automated, and precise wafer loading and chuck maintenance process to maximize throughput. This allows contamination levels to stay to stay at a minimum, allowing for reliable processes and improved yield rates. The Enabler E2 is a highly customizable and flexible unit, capable of processing wafers up to 200 mm in diameter with temperatures ranging from room temperature to 200 degrees Celsius. This makes the machine well-suited for a variety of advanced device fabrication processes such as oxide etching, CMP, and deposition. In short, APPLIED MATERIALS CENTURA ENABLER_E2 is an industry-leading high-density plasma oxide etch reactor for advanced device manufacture. It features a high-density uniform plasma design, a customizable etch chamber, and a closed-loadlock tool for contamination control, allowing it to process various sizes and temperatures safely and accurately. With the ability to etch deep within feature geometries and minimize particle and contamination levels, the Enabler E2 provides superior device performance, reliability, and yield rates.
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