Used AMAT / APPLIED MATERIALS Centura HP PVD #9266424 for sale
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ID: 9266424
Vintage: 1995
Sputtering system, 6"
Chamber type:
Chamber A: AL
Chamber B: AL
Chamber C: PC-II
Chamber D: TiTiN
Chamber E (Orient / Degas)
Chamber F (Orient / Degas)
Chamber A:
Heater type: 4F
Source type: 11.3"
Body: STD
Adaptor: STD
Manometter: Single 0.1 torr (6274A)
Ion gauge: Nude
Lift cylinder: STD
Basic motorize
Gate vavle: 2P
Cryo pump: EHN-OB8F
Chamber B:
Heater type: 4F
Source type: 11.3"
Body: STD
Adaptor: STD
Manometter: Single 0.1 torr (6274A)
Ion gauge: nude
Lift cylinder: STD
Basic motorize
Gate vavle: 2P
Cryo pump: EHN-OB8F
Chamber D (PVD):
Heater type: 101
Source type: 11.3"
Body: STD
Adaptor: STD
Manometter: Single 0.1 torr (6274A)
Ion gauge: nude
Lift cylinder: STD
Basic motorize
Gate vavle: 3P
Cryo pump: EHN-OB8F
Chamber C (PC-II):
Resonator: STD
Body: Turbo
Basic pedestat
Turbo adaptor: Short
Manometter: Single 0.1 torr (6274A)
LEYBOLD 361C Turbo pump
Match box: 6"
Lift cylinder
Electrical requirements:
Controller type: Centura standard
Electrical interface: Top feed AC cable
Main frame:
Type: Main frame I
System placement: Stand alone
Robot type: HP Robot
Robot blade: NICKEL Coated AI
Loadlock:
Loadlock cassette: Wide body
Index type: With rotation
Cassette handler: Metal
Basic loadlock wafer mapping
Dual stage vent type
Gas delivery:
Filters:
Veriflo 10 Ra Max
Pall
Generator:
Chamber A:
MDX Power: MDX-L12-650
Chamber B:
MDX Power:
MDX-L12M
MDX-L12
Chamber C: LF-10A Generator
CPS-1001S Missing
Chamber D:
MDX Power: MDX-L12
NESLAB-I Heat exchanger
(2) 9600 Compressors
Umbilicals:
MF - AC rack: 300"
Pumps:
System: A30W
PC-II: A07
Includes:
Serial isolator
System reset
Lk Det 5 and 6 / Conv / TC
(3) Lk Det 7 and 8 / Conv / TC
Floppy Disk Drive (FDD)
Hard Disk Drive (HDD)
Chamber A, B, C, D & E: Interface
Mainframe interface
Loadlock interface
Chamber A, B, C & D:
Dl/O 1
Dl/O 2
Chamber E: Dl/O
Synergy SBC
Video
SEI
Chamber A, B, C & D: Al/O
Chamber E/MF: Al/O 2
Mainframe:
Al/O 1
Dl/O 1
Dl/O 2
Dl/O 3
Dl/O 4
Dl/O 5
Dl/O 6
(3) Steppers
OMS
No shutter (Chamber A, B & D)
1995 vintage.
AMAT / APPLIED MATERIALS Centura HP PVD (physical vapor deposition) reactor is a next-generation deposition equipment that is designed to provide advanced, high-performance thin-film deposition capabilities. This innovative system delivers various deposition recipes through multiple tools and chambers, and is optimized for increased process flexibility and production efficiency. AMAT Centura HP PVD reactor is capable of depositing a wide range of materials, including but not limited to copper, aluminum, titanium nitride and tungsten. It utilizes multiple, selectable gases and inert gases to precisely control the source of material, and to create the perfect environment and pressure needed for optimal thin-film deposition. The Select Source™ (SS) linear accelerator and Turbo-Pumped™ power source (TPP) ensure that the reactive pressures and temperatures that are needed for the process are maintained. APPLIED MATERIALS Centura HP PVD unit also features a temperature-controlled lift-off/etch module with an integrated, high-temperature bake. This module is designed to automatically control the temperature around the substrate during the lift-off and etch process, to minimize the effects of unwanted thermal contact. It also features a fast-thermal scan in order to accurately profile the film growth and etch depth. Aside from its excellent PVD capabilities, Centura HP PVD reactor is designed to provide superior uptime and productivity. The machine's modular configuration allows for quick and easy tool loading, and comes with a powerful software and graphic user interface that can be easily used by operators of any skill level. The tool also comes with an automated recipe feature, which simplifies the deposition process by saving users time and effort. Overall, AMAT / APPLIED MATERIALS Centura HP PVD reactor is an advanced deposition asset that offers excellent thin-film deposition capabilities and superior process flexibility. Its temperature-controlled lift-off/etch module, Select Source linear accelerator, Turbo-Pumped power source, and automated recipe feature make it an ideal tool for high-performance thin-film deposition.
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