Used AMAT / APPLIED MATERIALS Centura I P1 #9133087 for sale
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ID: 9133087
WxZ system, 6"
Chamber Type/ Location
Position A WXZ
Position B WXZ
Position C WxP
Position D WxP
Position E MULTE COOLDOWN
Position F ORIENTER
Electrical Requirements
Line Voltage 200/208 VAC
Line Frequency 50~60 Hz
System Safety Equipment
EMO Guard Ring INCLUDED
Water and Smoke Detector ALARM
System Labels ENGLISH with Chinese simplified
Wxz Chamber Options
Bias Generator STANDARD ENI 12B3
Slit Valve Oring STANDARD
Throttle Valve STANDARD THROTTLE
Wxz Chamber Options
Bias Generator STANDARD ENI 12B3
Slit Valve Oring STANDARD
Throttle Valve STANDARD THROTTLE
Wxz Chamber Options
Bias Generator STANDARD ENI 12B3
Slit Valve Oring STANDARD
Throttle Valve STANDARD THROTTLE
Wxz Chamber Options
Bias Generator STANDARD ENI 12B3
Slit Valve Oring STANDARD
Throttle Valve STANDARD THROTTLE
Orienter Chamber Options
Chamber Type MULTE COOL DOWN
Pallet Options
General Mainframe Options
Facilities Type REGULATED
Facilities Orientation MAINFRAME FACILITIES BOTTOM CONNECTION
Weight Dispersion Plates Mainframe And Remote
Chamber Flow Switch Options
Loadlock/Cassette Options
Loadlock Type Narrow Body AUTO ROTATION
Loadlock Platform UNIVERSAL
Cassette Type Supported 200 mm
Loadlock Cover Finish ANTI-STATIC PAINTED
Loadlock Slit Valve Oring Type VITON
Wafer Mapping ENHANCED
Integrated Cassette Sensor YES
Transfer Chamber Options
Transfer Ch Manual Lid Hoist YES
Robot Type HP
Robot Blade Option ROUGHENED AL BLADE
Wafer On Blade Detector BASIC
Loadlock Vent BOTTOM VENT
System Controller
Controller Type
Cntrlr Electrical Interface BOTTOM FEED
Controller Exhaust TOP EXHAUST
System Monitors
System Monitor 1 STANDALONE
Monitor Cursor BLINKING CURSOR
AC Rack
Controller Facility Interface REMOTE UPS INTERFACE ONLY
AMAT / APPLIED MATERIALS Centura I P1 is a single-wafer cluster tool for semiconductor manufacturing. It is designed to create a unique, low-temperature shallow trench isolation (STI) process to reduce device stress due to polishing, etching, and vacuum processing. This reactor supports both low-k and dielectric polishing processes, enabling device structures with increased scaling capability and improved performance. It also boasts an advanced wafer transfer mechanism for improved accuracy and repeatability of process steps during manufacture. AMAT Centura I P1 reactor is a thermal chemical oxide (TCO) cluster tool designed to provide a high-performance STI solution while mitigating adverse environmental and manufacturing risks. At the heart of the tool is a DEIONIZED WATER (DI) Ultrashower, which ensures a precise and repeatable wafer temperature profile during processing. The tool executes a flow of DI and a specific set of gaseous precursors to form isolated trenches or pits in the wafer. The result is a truly uniform wafer-scale STI process that reduces device stress levels and increases performance. APPLIED MATERIALS Centura I P1 reactor is also equipped with a Low Temperature End-Point detector (LTEP) that accurately measures the end-point of the process. The LTEP maintains a preset uniformity for the STI process which results in clean, repeatable and uniform results. The tool also offers a low-k polishing capability that reduces parasitic capacitance between adjacent transistor nodes. This is a key process for device structures that need more scaling and improved performance. The tool is also equipped with an advanced wafer transfer mechanism that facilitates easy loading and unloading of wafers. It offers vertical wafer alignment for more accurate tracking of the wafer edges during the process, thus improving the wafer-to-substrate repeatability. Centura I P1 reactor is ideal for those in need of low-cost and high-performance STI process applications. With its low-k polishing and wafer transfer capabilities, it is a cost-effective and reliable tool for those in need of yield-critical, reduced-stress, consistently repeatable, and uniform STI results.
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