Used AMAT / APPLIED MATERIALS Centura II DPS+ #293608752 for sale

AMAT / APPLIED MATERIALS Centura II DPS+
ID: 293608752
Wafer Size: 6"
Poly etcher, 6" (2) Chambers JMF.
AMAT / APPLIED MATERIALS Centura II DPS+ is an innovative plasma etch reactor equipment designed to be an ultra-high performance device for high-precision etching of materials. This system has been designed to achieve the highest level of accuracy and performance when etching semiconductor substrates. AMAT Centura II DPS+ has a process chamber that features an improved, enclosed design which minimize outgassing and operator safety risks. The hot-wall design of the chamber improves plasma uniformity and significantly reduces thermal shock to the substrate material. All materials process through a showerhead, rather than a directional etch, which provides homogeneous etch profiles across the substrate. APPLIED MATERIALS Centura II DPS+ unit has several controls which allow for precise adjustment of the etching process. These include the ability to adjust the temperature, gas flow, and voltage of the process chamber. The temperature, gas flow, and voltage have been optimized for specific applications, including deep trench etching, high speed etching, and aspect ratio etching. The combustible gas exhaust of Centura II DPS+ is kept under tight control, ensuring the highest levels of operator safety. In addition, AMAT / APPLIED MATERIALS Centura II DPS+ uses an advanced closed-loop control machine, allowing for intricate control over the process. AMAT Centura II DPS+ also includes enhanced optics and angulated gas lines for increased axis uniformity. The optics of the tool also increases throughput and allows for improved etch quality. APPLIED MATERIALS Centura II DPS+ is fully compatible with AMAT FOBOS (Fully Automated Multi-Operation Process Asset), which automates multiple operations. This automated model is designed to ensure consistent quality across multiple batches of product and the highest possible yield. Overall, Centura II DPS+ is an advanced and reliable plasma etch reactor capable of high-precision etching of semiconductor substrates. It features a highly automated and adjustable process chamber, enhanced optics and angulated gas lines, and a closed loop control equipment. The system is also fully compatible with APPLIED MATERIALS FOBOS. All this makes AMAT / APPLIED MATERIALS Centura II DPS+ the perfect solution for a range of etching applications.
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