Used AMAT / APPLIED MATERIALS Centura II DPS+ #9202744 for sale
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ID: 9202744
Wafer Size: 8"
Metal etcher, 8"
(4) Chambers
Chamber type:
Loadlock: Wide
Robot: VHP+
Position A / B: Metal DPS+
Position C / D: ASP+
Position E: Fast cool down
Position F: Orienter
Chamber A and B:
Process: DPS+
Upper chamber body: Anodizing
Electrostatic chuck: Polyamide
SEIKO SEIKI STPH 1303C Turbo pump
DTCU: E-EDTU
Endpoint: Monochromator
Bias generator: OEM 12B (-08)
Bias match: 0010-36408
ENI GMW-25A Source generator, 2500 W
Throttle valve / Gate valve: VAT TGV
Chamber C and D:
Process kit: Chuck
Auto tuner: Smart match 3750-01106
MAGNETRON Head: 0190-09769
ASTEX AX2115 Generator
Process control: Manometer
Gas box:
VDS Type: 750 SCCM
IHC Module: MKS 649
Transfer chamber:
Manual lid hoist
Robot: VHP+
Umbilical cable: 55 Feet
2001 vintage.
AMAT / APPLIED MATERIALS Centura II DPS+ is a highly advanced plasma processing system designed for production use. This multi-chamber, three station reactor offers maximum features in an overall compact package for deposition, etch and source chamber capabilities. AMAT Centura II DPS+ reactor is optimized for cost-effective productivity and uniformity, offering improved throughput and process control. The EMS chamber of APPLIED MATERIALS Centura II DPS+ is designed for semiconductor epitaxial deposition on different substrates. It is used in a variety of applications such as silicon-germanium, GaN, diamond and carbon nanotubes. The reactor includes a Wide Energy Bandwidth Crucible that offers high deposition rates and exceptional uniformity. Additionally, the built-in Auto-Scan feature allows users to program a maximum of five recipes. The EOS chamber of Centura II DPS+ is a highly versatile etch system. It supports wet, dry, and hybrid processing technologies, including etching of both metals and semiconductors. The chamber is equipped with precision control of multiple etch parameters such as power, pressure, temperature, and flow rate. The system is designed to maximize process flexibility and uniformity, allowing for different substrates and substrates sizes. Finally, the source chamber of AMAT / APPLIED MATERIALS Centura II DPS+ provides a reliable source for deposition precursors. It is outfitted with a high capacity rotary valve that is designed to handle a variety of vaporized materials. The chamber also features a fast reactivation rate with a very low dynamic pressure. These features contribute to a dramatically enhanced process stability. Overall, AMAT Centura II DPS+ reactor is a reliable and powerful tool ideal for production use. With its powerful multi-chamber, three-station design, users can benefit from improved thermal and chamber uniformity and maximum throughput. The reactor is capable of handling different deposition, etch, and source processes with precision control of multiple parameters, making it an optimal choice for fabrication needs.
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