Used AMAT / APPLIED MATERIALS Centura II DPS+ #9253108 for sale
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ID: 9253108
Wafer Size: 8"
Vintage: 2000
Poly etcher, 8"
Loadlock: Narrow
Position A, B, C: Poly DPS+
Position F: Orienter
Chamber A, B, C:
Upper chamber body: Anodizing
Electrostatic chuck type: Ceramic
Turbo pump: SEIKO SEIKI STP-A2203
DTCU: E-EDTU
Endpoint missing
Bias generator: ENI ACG-6B
Bias match: 0010-36408
Source generator: ADVANCED ENERGY ALTAS 2012
Throttle valve and gate valve: VAT TGV
Gas box:
IHC Module: MKS 649
Transfer chamber manual lid hoist missing
Robot: VHP+
Umbrical cable: 50 ft
2000 vintage.
AMAT / APPLIED MATERIALS Centura II DPS+ Reactor is an enhanced plasma processing equipment specifically designed for high-volume semiconductor manufacturing and advanced application processes. It is a high-throughput, single-wafer dry etch tool for etching thin-film devices, such as polysilicon and silicon nitride. The reactor makes use of a proprietary Atmospheric Pressure Remote Plasma Source (APRPS), enabling the deposition of conformal films that can provide minimal deposition of extraneous material. AMAT Centura II DPS+ Reactor is suitable for a variety of etch and deposition processes that can achieve very high accuracy and repeatability. APPLIED MATERIALS Centura II DPS+ Reactor is a self-contained system, consisting of the process chamber, a gas distribution unit, and the APRPS source. The process chamber is made of durable stainless steel and is designed to provide highly precise, uniform wafer processing under precise control and monitoring. The gas distribution unit is used to deliver process gases, plasmas, and precursors to the wafer plane, allowing for a uniform plasma etch to be done over multiple wafers at a time. The APRPS source, also referred to as an "Atmospheric Pressure Self-purging Plasma Technology" or AP-SPT, is the driving force behind Centura II DPS+ Reactor. It consists of an advanced plasma source and can etch with either un-passivated or passivated wafers, while providing a precise etch profile that can be optimized to fit the particular process requirement. AMAT / APPLIED MATERIALS Centura II DPS+ Reactor offers a variety of process capabilities, such as time-based etch, reactive-ion etch (RIE), and anisotropic and isotropic dry etch. It can also be optimized for deep reactive-ion etch (DRIE) processes that enable ultra-shallow trench etching. It also features a sophisticated temperature monitoring unit, which helps provide optimal operational performance and productivity. Furthermore, it has advanced diagnostics, such as optical feedback and advanced temperature control, making it easier to adjust and maintain process parameters. In addition, AMAT Centura II DPS+ Reactor provides electrical feed-throughs to enable stable, high-power wafer processing with low voltage ranges. Overall, APPLIED MATERIALS Centura II DPS+ Reactor is a versatile and powerful semiconductor processing machine that enables precise, highly repeatable etch and deposition processes. It is an excellent choice for manufacturers who require reliable, high-throughput tools for advanced application processes. Its wide range of features, advanced diagnostics and temperature monitoring systems, and supportive technical services make it ideal for a variety of processing needs.
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