Used AMAT / APPLIED MATERIALS Centura II DPS #9402435 for sale

AMAT / APPLIED MATERIALS Centura II DPS is a high-volume batch-process thin-film deposition equipment designed for advanced R&D and production applications. The system has been designed to provide a fast and reliable method of thin-film growth, and is suitable for multiple applications in silicon integrated circuit fabrication processes, such as sputter etching, deposition of dielectrics, and other advanced process steps. The unit includes two modules: the thin-film deposition module, which provides precise control of the rate of deposition in a single chamber, and the sputtering module, which provides optimal control over the sputtering processes. Both are powered by a combination of direct current (DC) plasma source and radio frequency (RF) plasma source. The thin-film deposition module uses RF power to generate plasma and deposit films on the substrate. The process can be used to deposit films up to a thickness of 50nm, with excellent repeatability. The DC and RF sources can be used in combination to control the flow of material through the deposition chamber. The chamber includes a temperature-controlled vacuum chuck and motion-controlled transport machine. The motion-control can be used to precisely control the deposition rate and ensure uniformity of films. The transport tool also provides a quick, easy way to move substrates from chamber to chamber without manual intervention, resulting in reduced cycle times. The sputtering module uses argon gas to generate an ion source for etching and for sputtering films onto substrates. The asset has the ability to process substrates up to 10 inches in diameter and utilizes adjustable DC power to control the rate of etching. The sputtering module is designed to provide uniformity and reproducibility, while also providing a high degree of control over the quality of films. AMAT Centura II DPS is a high-tech production solution that offers reliable and consistent results. The model has been designed to provide fast and precise thin-film deposition, while also allowing the user to adjust parameters to achieve the desired results. The combination of DC and RF sources and the high level of control ensures repeatability and uniformity of films.