Used AMAT / APPLIED MATERIALS Centura II eMax #9259043 for sale
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ID: 9259043
Wafer Size: 8"
Oxide etcher, 8"
Gas panel type: VME2
Gas panel exhaust: Top feed
Chamber F: Orientor
Metal robot blade
Wafer type: Flat
Wafer sensors: Wafer slide
Robot type: VHP
Loadlock type: Narrow body with tilt out
System umbilicals: 75 ft
Mainframe: Centura II
Loadlock slit valves: Viton
VME Rack
Chase CRT
No subfab CRT
No OTF
Chamber A, B and C:
Chamber type: E-Max
Process: Oxide
Dual manometer: 1 Torr
Slit valve and chamber O-ring: Viton
Lid type: Dual gas feed-thru
Throttle valve, P/N: 3930-00015
ENI 28B LF Generator
RF Match, P/N: 0010-30686
Endpoint system
Chamber clamps
Process kit type: ESC
ATH 1600M Turbo pump
No heated valve stack
Gas valves: Veriflo
Chamber A gases:
Gas / MFC Size / Gas name / MFC Type
Gas 1 / 50 sccm / C4F6 / BROOKS
Gas 2 / 100 sccm / CH2F2 / BROOKS
Gas 3 / 500 sccm / CO / BROOKS
Gas 4 / 50 sccm / C4F8 / BROOKS
Gas 5 / 1 slm / AR / BROOKS
Gas 6 / 20 sccm / O2 / Unti 8160
Gas 7 / 300 sccm / O2 / BROOKS
Gas 8 / 100 sccm / CF4 / BROOKS
Gas 9 / 100 sccm / CHF3 / BROOKS
Gas 9 / 200 sccm / ARSS / BROOKS
Chamber B gases:
Gas / MFC Size / Gas name / MFC Type
Gas 1 / 50 sccm / C4F6 / BROOKS
Gas 2 / 100 sccm / CH2F2 / BROOKS
Gas 3 / 500 sccm / CO / BROOKS
Gas 4 / 50 sccm / C4F8 / BROOKS
Gas 5 / 1 slm / AR / BROOKS
Gas 6 / 20 sccm / O2 / BROOKS
Gas 7 / 300 sccm / O2 / BROOKS
Gas 8 / 100 sccm / CF4 / BROOKS
Gas 9 / 20 sccm / CHF3 / BROOKS
Gas 10 / 200 sccm / ARSS / BROOKS
Chamber C gases:
Gas / MFC Size / Gas name / MFC Type
Gas 1 / 50 sccm / C4F6 / BROOKS
Gas 2 / 100 sccm / CH2F2 / BROOKS
Gas 3 / 500 sccm / CO / BROOKS
Gas 4 / 50 sccm / C4F8 / BROOKS
Gas 5 / 1 slm / AR / BROOKS
Gas 6 / 20 sccm / O2 / Unti 1660
Gas 7 / 300 sccm / O2 / BROOKS
Gas 8 / 100 sccm / CF4 / BROOKS
Gas 9 / 20 sccm / CHF3 / BROOKS
Gas 10 / 200 sccm / ARSS / BROOKS
Power supply: 208 VAC, 180 Amps, 50/60 Hz.
AMAT / APPLIED MATERIALS Centura II eMax is an advanced reactive ion etching equipment designed for semiconductor fabrication processes. The system uses inductively coupled plasma (ICP) technology to enable high-precision, low-damage processing of a wide range of materials. It offers highly controllable etch depths, as well as excellent repeatability, to help ensure quality and consistency in the fabrication of advanced semiconductor devices. AMAT Centura II eMax integrates several advanced technologies to provide cutting-edge etching capability. These include an advanced ICP source with high power densities and frequency agility, a positional stage with direct control of the etching end-effector, high resolution image processing, and a Windows-based process control software suite. The integration of these components provides a fully-automated etching solution with a wide range of capabilities. APPLIED MATERIALS Centura II eMax is designed to be an economical option for semiconductor production. Its small footprint and high processing speed combine to make it a cost-effective choice for high volume fabrication environments. Additionally, the unit requires minimal maintenance and offers a range of features for further reducing operating costs. The machine's ICP source delivers high power densities and wide frequency agility to facilitate precise etch depth control, as well as excellent repeatability for better reliability and quality control. Additionally, the Direct Digital Control (DDC) stage provides highly precise motion and positioning for increased control over the etching process. This helps ensure high quality and precision etching. Centura II eMax also includes a high resolution image processing tool to further aid in etch quality control, as well as a Windows-based process control software suite to provide users with powerful and easy-to-use process control. AMAT / APPLIED MATERIALS Centura II eMax is a powerful and durable etching asset that is capable of providing high-precision etching to advanced semiconductor materials. Its advanced technologies provide excellent control over the etching process, while its economical design and easy-to-use process control software help streamline and reduce the total cost of ownership.
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