Used AMAT / APPLIED MATERIALS Centura IPS #293829876 for sale

AMAT / APPLIED MATERIALS Centura IPS
ID: 293829876
Wafer Size: 8"
Etchers, 8".
AMAT / APPLIED MATERIALS Centura IPS (Integrated Process System) is an advanced sputter system designed for the deposition of thin films for use in semiconductor manufacturing. It is a fully integrated platform that allows for the simultaneous deposition of multiple layers of materials onto substrates in a single run. The IPS provides an easy to use platform for reliable and accurate deposition. The most unique feature of the IPS is its patented sputter-etch technology. This technology allows layer deposition and etch-cleaning to be done in a single step, reducing production times and increasing efficiency. This improves throughput and increases yield. Additionally, the IPS is capable of creating complex layered structures, such as copper-silver-gold that are critical for ultra-low-k dielectric materials. The IPS also features a variety of advanced process control capabilities. Its Closed Loop RF Power Control (CLRPC) allows for precise power level control for each of its targets and precise magnetic field control to maintain parity between deposition rate, etch rate, and ionized reactive species formation. This reduces uncontrolled variations and maintains a higher level of product integrity and repeatability. The IPS also offers quick changeover capabilities for providing recipe-controlled process conditions for significant cost savings and scalability. Its automated and unified recipes further streamline the process and reduce process time and scrap yield. The IDP drive can also be adapted to transferring, aligning, and positioning multiple technologies, with no need for manual intervention. AMAT Centura IPS is an all-in-one tool for reliable deposition of complex thin film structures, with built-in advanced process control capabilities, automated process atmosphere control, and enhanced data acquisition and processing capabilities. The IPS ensures quick set-up changes and cycle times, offering the smoothest possible wafer- to-wafer process control. This makes it an ideal solution for the deposition of ultra-low-k dielectrics and other component materials in semiconductor manufacturing.
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