Used AMAT / APPLIED MATERIALS Centura MxP+ #9257030 for sale
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ID: 9257030
Wafer Size: 8"
Vintage: 1995
System, 8"
Wafer shape: SNNF
Centura type: Centura 1
No SMIF interface
Chamber B and C: MXP+
Chamber F: Orient
Buffer robot type: HP
Buffer robot blade: Metal
MF Facilities: Bottom
Smoke detector: Alarm
AC Rack type: Phase 1
Controller rack type: Phase 1
Controller to AC rack: 60 Ft
Pump interface cable: 50 Ft
Load lock type: Wide body / Core tool
Wafer detector: Alarm
Wafer sensor
EMO
Monitor and EDP monitor: Wall mount
Controller to mainframe: 60 Ft
RF to Chamber coaxial: 50 Ft
Chamber A, B and C:
Chamber type: MxP+
IHC Type: MKS 1179
Lid type: Clamp
Bias RF match
Magnet driver
Cathode type: Simply cathode
Gate valve: VAT Gate
ESC Type: Polymide
Manometer type: 1 Torr
Slit valve O-ring: Viton
RF Generator bias: OEM-12B
Endpoint system: Monochrometer
Turbo pump: SEIKO SEIKI 301
Throttle valve: Butterfly
No auto bias
Gas configuration for chamber A, B and C:
GAS 1 / CH2F2 / 100 SEC-4400MC
GAS 2 / SF6 / 100 SEC-4400MC
GAS 3 / N2 / 100 SEC-4400MC
GAS 4 / O2 / 100 SEC-4400MC
GAS 5 / CF4 / 150 SEC-4400MC
GAS 6 / CHF3 / 200 SEC-4400MC
GAS 7 / AR / 200 SEC-4400MC
Gas delivery options:
STEC MFC
Filter: MOTT
Transducer: Core tool
Gas connection: Single line drop
Gas line feed direction: Bottom
Exhaust feed side: BD Side
Transducer displays: Core tool
Regulator: Core tool
Valve: Core tool
Gas line feed side: AC Side
Exhaust: Top
(2) Chillers:
NESLAB HX150 Heat exchanger for cathode and wall
W/RS-485 Interface
Chiller hose size: 3/8 Quick
Generator rack and chiller valve connection: Manifold
Transformer: 208 / 400 A
Line frequency: 60 Hz
1995 vintage.
AMAT / APPLIED MATERIALS Centura MxP+ is a specialized PVD (physical vapor deposition) reactor designed for high-volume production and the deposition of metal and compound films. The equipment's modular design allows for a flexible and scalable process configuration while providing superior product uniformity and high process throughput. The stationary multi-panel process chamber is made of stainless steel and has a unique shape that allows for efficient heat transfer and uniform deposition of the material over the entire wafer. AMAT Centura MxP+ reactor is protected by a proprietary gas purification system that uses a diffuser to filter contaminants from the process environment, allowing for a more consistent material growth. The unit is outfitted with a robust set of control and monitoring features, including a high-resolution real-time process computer, adjustable temperature platen and an electron beam gun with an integrated shutter for precise deposition control. Additionally, three independent ion sources are available, allowing for precise surface cleaning and high-energy etching. Other features include a multi-drive machine, which can provide fast substrate heating and cooling, as well as drive optimization for high-thickness uniformity. Furthermore, the built-in gas monitor can detect low levels of oxygen and other impurities in real-time, helping to ensure consistent wafer quality. APPLIED MATERIALS Centura MxP+ reactor is constructed to meet the current SEMI standards for operation and safety. Its internal sensors detect any faults in the tool during normal operation and send an alert to the monitor. Furthermore, the advanced SEMI S2 factory automation protocol ensures that the safety of the asset is monitored continuously, and it is able to detect and prevent any unexpected combustible gas explosions. In addition to being easy to operate and maintain, Centura MxP+ reactor also uses advanced technology for precise thickness control. The model's integrated module, Process Automation Layer (PAL), automatically adjusts the process flow based on given parameters to achieve optimal process uniformity. The PAL is capable of fine-tuning deposition rate and profile to a resolution of 1 nm. This allows for maximum surface planarity and product quality without sacrificing throughput. Overall, AMAT / APPLIED MATERIALS Centura MxP+ is a high-performance PVD reactor designed for high-volume production and the deposition of metal and compound films. It offers robust control and monitoring features, precise thickness control, and has been constructed to meet current safety standards. The equipment is also easy to operate and maintain, and its advanced features make it an ideal choice for semiconductor and advanced packaging applications.
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