Used AMAT / APPLIED MATERIALS Centura PE CVD #9116532 for sale

AMAT / APPLIED MATERIALS Centura PE CVD (Plasma Enhanced Chemical Vapor Deposition) is a full-featured, single-wafer reactor designed for performing high-quality, plasma-enhanced chemical vapor deposition (PECVD) of photoresist on polysilicon, silicon, and other substrates. The PE CVD process is based on the application of two or more gases to the substrate by means of a plasma. The source gases are typically silane (SiH4) for the growth of polysilicon films or diborane (B2H6) for the growth of silicon nitride films. The gases are transported to the reaction chamber through a gas distribution manifold, and the reactive species for the film formation are generated by a plasma formed between two or more electrodes powered by a Microwave Generator. AMAT Centura PE CVD equipment offers a wide range of process capabilities, including the ability to deposit high-quality, thin films over large areas, high throughput, and evenly distributed plasma across the substrate. The plasma is generated via an electrode assembly, which consists of two dielectric rings and several tungsten inserts located around the wafer. The plasma is directed to the substrate via an automated slit-ring system that ensures uniform and efficient gas delivery. The gas delivery unit utilizes patented technologies, such as variable gas delivery valves and pre-calibrated gas injection points, to ensure high throughput and low deposition non-uniformity. Themicrowave generator is capable of delivering up to 20 kW of RF power to generate a plasma of the desired electron density at the substrate to ensure uniform film growth. The Centura also features dedicated process monitoring and diagnostic functions, such as in situ diagnostic spectroscopy, to ensure the highest quality deposition. The machine is equipped with a controller unit that enables the user to monitor and manage the process parameters in real time. APPLIED MATERIALS Centura PE CVD tool is designed to provide superior process uniformity and film growth characteristics. It offers automated chemical management and precise control of the deposition process, such as temperature, time, pressure, and gas flow. With its robust design, the asset is capable of operating reliably over extended periods of time and can easily be reconfigured to suit a variety of production needs.