Used AMAT / APPLIED MATERIALS Centura RTP XE #9188733 for sale

AMAT / APPLIED MATERIALS Centura RTP XE is a multi-mission reactive ion etch (RIE) reactor designed for high-aspect-ratio micromachining and etching applications. The reactor is composed of an inductively coupled plasma (ICP) source, a magnetron sputter power supply, a process control panel, and a process chamber. The ICP source generates the plasma, and consists of a resonator powered by an RF generator up to 400kHz, in addition to independent control of all RF sources. The dual-frequency magnetron sputter source consists of a planar and a cylindrical magnetron, and is capable of providing up to 200W of power to each of them. Using a dual frequency allows for the deposition of layers with uniform thickness. The process control panel is powered by a high-speed computer, and includes a graphical user interface with real-time parameter feedback. This allows for complex process recipes to be designed and modified easily. The panel also allows the operator to monitor and control the etching process, including setting the desired etch rates, etch selectivity, etch uniformity, deposition rates, and process recipes. The process chamber utilizes a chemical-resistant, high-temperature electrostatic-held wafer support, which ensures a uniform etch over the entire wafer edge. The process chamber also features an advanced perimeter gas distribution plate that distributes the process gas for directionally-controlled etch performance. This allows for shallow etching of high-aspect-ratio features. In addition to the enhanced process performance, AMAT Centura RTP XE also offers improved process stability and reliability. It features an integrated temperature control system to provide a precise temperature setting within the chamber walls, ensuring more consistent etching results. Combined, these features allow the operator to achieve high-yield production consistency while reducing process time and cost.