Used AMAT / APPLIED MATERIALS Centura RTP #9390840 for sale

AMAT Centura Series Reactive Ion Etch (RTP) tool is a versatile, high performance, dual chamber reactor designed for deep sub-micron processes in the semiconductor industry. It is equipped with ultra-high vacuum (UHV) chambers allowing for the delivery of ultra-pure etch gas mixtures in order to optimize process performance and repeatability. AMAT / APPLIED MATERIALS Centura RTP tool uses Plasma Reactors, which generate and control a plasma of ions for precise etching of a wide variety of materials. The plasma is generated by a high frequency power source in combination with a suitable gas mixture to produce the desired product morphology. The tool utilizes a planar inductive source to control the energy of the plasma resulting in superior etch rates and selectivity performance. This allows for efficient use of energy and a shorter process cycle time, improving product yield and reducing costs. AMAT Centura RTP also features state-of-the-art process control capabilities, such as automatic pressure and flow control, which allows for a high degree of repeatability and process robustness. APPLIED MATERIALS Centura RTP is equipped with a retractable wafer handling equipment which is designed to be isolated from the process chamber during processing, resulting in improved repeatability and yield. The tool is for deep sub-micron processing and is tolerant to dielectric etch rates and material selectivity. Its dual chamber design allows for separate processing of aluminum metals and poly silicon layers. Centura RTP is capable of extremely high throughput and is available in a variety of configurations to meet the needs of different production requirements. The system features both manual and automatic remote plasma cleaning (RPC) capabilities. The RPC unit is used to clean the surface of the wafer while in the process chamber, preventing particles from sticking to the wafer during the etching process. The RPC machine also prevents the buildup of organic materials on the chamber walls, reducing the need for frequent maintenance. AMAT / APPLIED MATERIALS Centura RTP is a versatile tool with an excellent selectivity-to-etch rate ratio. Its high performance features, such as RPC capabilities, make it a preferred etching tool for deep sub-micron processes in the semiconductor industry. The asset is designed for high throughput, repeatability, and reliability, making it a cost-effective choice for etch processes.