Used AMAT / APPLIED MATERIALS Centura Tectra #293821114 for sale
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ID: 293821114
Wafer Size: 8"
Vintage: 1998
Modified Chemical Vapor Deposition (MCVD) system, 8"
Chamber A Ti
Chamber B TiN
Chamber D
Chamber E
Chamber F
HP＋robot
Wide-Body Standard Mechanical Interface (SMIF) loadlock chamber
STEEL HEAD 0 Heat Exchanger (HE)
Dry pump
EBARA AA70W Chamber A
KASHIYAMA SD600PV-31 Chamber
EBARA AA70W Chamber D
EBARA AA40W Buff
EBARA AA40W LoadLock
SHINKO SEIKI SW-50 ASM Chamber A
SHINKO SEIKI SW-50 ASM Chamber B
SHINKO SEIKI SW-50 ASM Chamber D
Quartz insulator
(2) Face plates
(20) Screw chamber ISO clamps
(110) KALREZ O-rings
(8) Dovetail seals
(40) Pin lift heater tins
(5) Top liner ring tins
(4) Slit liner tins
(4) Shim tin
(2) Shield Remote Procedure Calls (RPC)
(4) Quartz insulator Remote Procedure Calls (RPC)
(2) Pedestal shield Remote Procedure Calls (RPC)
(2) Pedestal Remote Procedure Calls (RPC)
(5) Outer shield Chemical Vapor Deposition (CVD) ti
(4) Lid liners ti
(4) Isolator lid flange ti
(4) Isolator chambers ti
(4) Insert liners ti
(2) Gas trench Remote Procedure Calls (RPC)
(5) Face plate tins
(5) Face plates nickel ti
(4) Edge ring heaters ti
(4) Blocker plates ti
(2) Belljar Remote Procedure Calls (RPC)
Liner exhaust ti
(2) Ceramic heaters
TMP340MC Turbo pump
(7) Clamp isolator
(3) Spool exhaust CHB ticl4 tins
Quartz insulator
Plate lid plated ticl4 ti, 8"
1998 vintage.
AMAT / APPLIED MATERIALS Centura Tectra reactor is a single wafer reactive ion etch (RIE) equipment designed to meet the needs of advanced semiconductor technology processes. It is ideal for applications such as high density, high aspect ratio patterning, bondfilm removal, and photoresist stripping. AMAT Centura Tectra system is a wide-ranging RIE solution that is configured to the specific etching requirement of the application. It is built with the latest etch rate control modules, cloud characterization, temperature control, plasma process control, and monitoring applications. The unit provides a precision process capability with the fastest possible set-up time, highest throughput, and low particle generation in the most cost-efficient way. APPLIED MATERIALS Centura Tectra machine has a multiple chamber configuration, with up to 20 process chambers in operation, depending on the configuration. The tool is built with a large RF power supply, programmable power control, and control of RF power output to each process chamber. It also comes equipped with a proprietary chemical delivery asset for precise and reliable plasma process control. The model is also equipped with a high-resolution imaging equipment that enables users to monitor process results in real-time. Additionally, the platform is made up of advanced sensing systems with temperature control and vibration mitigation capabilities that enable precise and repeatable results throughout the entire process. Centura Tectra system has a wide range of chamber options, from single chamber to dual or multi-chamber configurations. It also provides quick etch rate control for process optimization, as well as precise morphology control for high etch selectivity. The sophisticated components of the unit have enabled the development of exceptional repeatability in etching processes. Additionally, scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) are available for advanced metrology and analysis of the etch results. AMAT / APPLIED MATERIALS Centura Tectra is a versatile RIE solution that provides users with a variety of features for etching process optimization. It supports the development of advanced technology and is ideal for use in high-volume production processes.
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