Used AMAT / APPLIED MATERIALS Centura Ultima HDP #9189127 for sale
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ID: 9189127
Wafer Size: 8"
CVD System, 8"
NBLL
3-Channels HDP:
Side nozzle: (18) Holes AL 203
Top baffle: Single hole AL 203
ESC with WTM
HP Robot
Wafer shape: Flat.
AMAT / APPLIED MATERIALS Centura Ultima HDP is a reactor designed for high-density plasma (HDP) deposition processes used in semiconductor device fabrication. The HDP equipment produces an ultra-dense, homogeneous, and low temperature plasma potential, which enhances film deposition uniformity and quality. The HDP system also features high-power density and delivers precise ion flux control, robust operation and excellent uniformity. In addition, AMAT Centura Ultima HDP features an advanced plasma source design that allows for a wide range of plasma chemistries to be used. The HDP unit is built for high-throughput fabrication, providing very rapid processing times. The HDP reactor is engineered for advanced high-density process (HDP) deposition, enabling the application of a variety of films, including thin gate oxides, gate stack films, gate spacers, gate line extensions, and silicides. Additionally, the plasma source design of APPLIED MATERIALS CENTURA ULTIMA+ HDP enables precise ion and etch process control, ensuring quick and precise ion flux and etch rate control, which minimizes critical dimension variation, reduces particle contamination and improves fine line resolution. AMAT / APPLIED MATERIALS CENTURA ULTIMA+ HDP is designed to be both user friendly and resource efficient, and features an intuitive software interface and closed-loop process control. This integrated process control capability ensures efficient operation, maintains optimal process performance and improves device yield. The HDP reactor's automated machine design also allows for remote-monitoring and full traceability to reduce downtime and improve efficiency. Centura Ultima HDP also features advanced process monitoring and control capabilities that allow for dynamic process adjustment, which enables precise control of process chemistry, mask temperature, and surface damage throughout the process. Additionally, the tool offers advanced diagnostic tools such as reside profiles and particle monitoring to help operators adjust and optimize process parameters for improved device performance. CENTURA ULTIMA+ HDP is a state-of-the-art asset for the deposition of high-density plasma films for semiconductor device fabrication. It offers precise ion flux and etch rate control, quick process times, efficient operation, and advanced process monitoring for improved device yields. The model is designed for user-friendliness, resource efficiency and overall process optimization, making it an ideal solution for modern HDP deposition requirements.
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