Used AMAT / APPLIED MATERIALS Centura Ultima HDP #9223731 for sale

ID: 9223731
Wafer Size: 8"
Vintage: 2001
CVD System, 8" System general: Mainframe: Centura 5200 DCVD Wafer type: Notch Chamber position A, B, C: HDP Ultima plus chamber, 8" Chamber E position: Multi-slot cool down chamber Chamber F position: Wafer orienter chamber System controllers: SBC V452 Board VGA Board P3 Board Facility and safety configurations: EMO Switch type: Turn to release EMO EMO Guard ring EMO Shunt trip Bracket standoff adapter Water and smoke detect output: Alarm Facility power indicator System water leak detector Main frame: Facilities type: Phase II System placement: Stand alone Front panel: Steel white polymer finish Facilities connection: VCR Facilities orientation: Mainframe facilities bottom connection Facilities water: Phase II water Controller IO interface option: I/O Expansion base card with seriplex gas panel card Interface: GEM Interface Load lock chamber type: Narrow body Transfer chamber: Transfer chamber manual lid lift Transfer chamber sensor Process chamber slit valve A, B, C: Bonded door with KALREZ O'ring Robot type: HP+ Robot (Dual speed) Basic wafer on blade detector N2 Purge MFC type: Unit instrument (UFC-1661) 1L Buffer purge slow vent flow: 500 sccm Dedicated transfer rough pump: EDWARDS Pump interface Mainframe inert gas lines: Chamber N2 supply Chambers N2 surface finish: 10 Ra Mainframe N2 supply Mainframes N2 surface finish: 10 Ra Chamber A configuration: Type: HDP Ultima plus chamber Frequency type: Top, side and bias RF Heater type: 0190-46458 Thermalogic board Manometer type: DUAL 10/100 TORR MKS Throttle valve: Turbo throttle valve plus rough throttle valve Gate valve type: 3870-04276, Pendulum ISO250 (Actuator 52.3) Turbo pump type: EBARA ET1600W Turbo pump controller: 1604W Turbo pump ring type: 0010-11762, CTR Ring assy, HDP-CVD Ultima plus Chamber O'ring type: KALREZ 9100 Clean method: RPS 0190-26744, MKS Astroni AX7670 Clean gas: NF3 Chamber A process kit: 0010-03090 ESC Cathode (WTM Type) 0040-18219 ESC (WTM Type) 0190-18430 WTM Probe 0200-18109 Collar 0200-18081 Cover ceramic 0200-01009 Top nozzle 0200-18093 Side nozzle 0200-01006 Dome 0040-04650 Gas ring with (24) nozzles 0200-40156 Lift pin ceramic Chamber B configuration: Type: HDP Ultima plus chamber Frequency type: Top, side and bias RF Heater type: 0190-46458 Thermalogic board Manometer type: Dual 10/100 TORR MKS Throttle valve: Turbo throttle valve plus rough throttle valve Gate valve type 3870-04276, Pendulum ISO250 Actuator 52.3 Turbo pump type: EBARA ET1600W Turbo pump controller: 1606W TF Turbo pump ring type: 0010-11762, CTR Ring assy, HDP-CVD Ultima plus Chamber o ring type: KALREZ 9100 Clean method: RPS 0190-26744RPS, MKS Astroni AX7670 Clean gas: NF3 EDWARDS Rough pump interface 0010-03090 ESC Cathode (WTM Type) 0040-18219 ESC (WTM Type) 0190-18430 WTM Probe 0200-18109 Collar 0200-18081 Cover ceramic 0200-01009 Top nozzle 0200-18093 Side nozzle 0200-01006 Dome 0040-04650 Gas ring with (24) nozzles 0200-40156 Lift pin ceramic Gas panel configurations: Gas panel type: HP 10 Ra Cabinet exhaust: Top exhaust Gas panel door Gas feed: Single-line drop (Bottom feed) Valve type: FUJIKIN 5 Ra max Filter: MILLIPORE Ni 10 ra max Fitting: VCR MFC: SEC-4400 MC (D-Sub 9 pins) Veriflo Regulator MKS Transducer with display unit Gas line configuration chamber A, B, C: Gas pallet: HDP Ultima plus Gas feed: Single-line drop (Bottom feed) Automatic gas line purging capability Gas 1: SiH4, 200 sccm Gas 2: NF3, 2000 sccm Gas 3: SiH4 Top, 20 sccm Gas 4: SIF4, 20 sccm Gas 5: AR Top, 50 sccm Gas 6: AR, 300 sccm Gas 7: HE, 200 sccm Gas 8: SIF4, 100 sccm Gas 9: O2, 400 sccm Gas 10: AR-MW, 2000 sccm System controller: Controller Type: Phase I Controller Controller GFCI: 30MA GFCI Controller UPS: Facilities ups interface Controller electrical interface: Top feed AC cables Controller exhaust: Top exhaust Cursor type: Blinking cursor Heat exchanger type: SMC Themo chiller, INR-498-001D Heat exchanger water fittings: Stainless steel Generator rack: Chamber A, B, and C top RF generator: ENI NOVA-50A Chamber A, B and C side RF generator: ENI NOVA-50A Chamber A, B and C bias RF generator: ENI GHW-50A Power: 200/208 VAC, 50 Hz, 400 A 2001 vintage.
AMAT / APPLIED MATERIALS Centura Ultima HDP Reactor is an advanced tool in the world of dry-in-place etching and conformal coating. This equipment is designed to allow manufacturers to achieve a high degree of precision with minimal effort and minimal complexity. The HDP stands for High-Density Plasma, the latest plasma technology that is designed to provide the highest level of performance and cycle-time control over a variety of processes. AMAT Centura Ultima HDP Reactor meets the increasingly complex needs of semiconductor manufacturers worldwide. The system's advanced features and modular architecture enable rapid implementation, flexibility and scalability for a wide range of applications. This includes ultra-thin conformal coating, deep reactive ion etching (DRIE), electroplated copper lift-off (ECLO), and other applications. APPLIED MATERIALS CENTURA ULTIMA+ HDP Reactor offers high levels of productivity with optimized throughput and cycle-time control. Its Multi-Frequency RF plasma source and water-cooled cathode enable small feature size control and low film stress while its linear mass flow controllers enable precision control over process gases. Its modular architecture allows it to be reconfigured with minimal disruption and configured in multiple chambers enabling fast and accurate processing of a numerous parts in parallel. The HDP Reactor features latest advancements in plasma source technologies to optimize etching and conformal coating processes. Its newly designed plasma source and chamber allow for high-aspect ratio etching and coating. The HDP Reactor's advanced process control capabilities help in achieving tight process distributions, lessening the need for manual adjustment by the operators. The unit's real-time process monitoring allows for quick decisions and rapid corrective action. This machine has integrated intelligent diagnostics for fast error feedback and minimal downtime. Its online simulation capabilities enable users to quickly tweak a recipe and make necessary changes without long set-up times. Furthermore, its data output can be used to record relevant process details and improve process monitoring capabilities. AMAT / APPLIED MATERIALS CENTURA ULTIMA+ HDP Reactor is the latest and most advanced tool in the world of dry-in-place etching and conformal coating. This tool is designed for semiconductor manufacturers seeking a reliable and efficient asset with high levels of precision and repeatability. Its advanced features and modular architecture enable rapid implementation and scalability, allowing it to be reconfigured with minimal disruption and configured in multiple chambers to cover a variety of applications. AMAT CENTURA ULTIMA+ HDP Reactor provides high levels of productivity and is equipped with the latest advancements in plasma source technologies, allowing users to achieve the precision required for complex processes.
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