Used AMAT / APPLIED MATERIALS Centura Ultima HDP #9223731 for sale
URL successfully copied!
Tap to zoom
ID: 9223731
Wafer Size: 8"
Vintage: 2001
CVD System, 8"
System general:
Mainframe: Centura 5200 DCVD
Wafer type: Notch
Chamber position A, B, C: HDP Ultima plus chamber, 8"
Chamber E position: Multi-slot cool down chamber
Chamber F position: Wafer orienter chamber
System controllers:
SBC V452 Board
VGA Board
P3 Board
Facility and safety configurations:
EMO Switch type: Turn to release EMO
EMO Guard ring
EMO Shunt trip
Bracket standoff adapter
Water and smoke detect output: Alarm
Facility power indicator
System water leak detector
Main frame:
Facilities type: Phase II
System placement: Stand alone
Front panel: Steel white polymer finish
Facilities connection: VCR
Facilities orientation: Mainframe facilities bottom connection
Facilities water: Phase II water
Controller IO interface option: I/O Expansion base card with seriplex gas panel card
Interface: GEM Interface
Load lock chamber type: Narrow body
Transfer chamber:
Transfer chamber manual lid lift
Transfer chamber sensor
Process chamber slit valve A, B, C: Bonded door with KALREZ O'ring
Robot type: HP+ Robot (Dual speed)
Basic wafer on blade detector
N2 Purge MFC type: Unit instrument (UFC-1661) 1L
Buffer purge slow vent flow: 500 sccm
Dedicated transfer rough pump: EDWARDS Pump interface
Mainframe inert gas lines:
Chamber N2 supply
Chambers N2 surface finish: 10 Ra
Mainframe N2 supply
Mainframes N2 surface finish: 10 Ra
Chamber A configuration:
Type: HDP Ultima plus chamber
Frequency type: Top, side and bias RF
Heater type: 0190-46458
Thermalogic board
Manometer type: DUAL 10/100 TORR MKS
Throttle valve: Turbo throttle valve plus rough throttle valve
Gate valve type: 3870-04276, Pendulum ISO250 (Actuator 52.3)
Turbo pump type: EBARA ET1600W
Turbo pump controller: 1604W
Turbo pump ring type:
0010-11762, CTR Ring assy, HDP-CVD Ultima plus
Chamber O'ring type: KALREZ 9100
Clean method: RPS
0190-26744, MKS Astroni AX7670
Clean gas: NF3
Chamber A process kit:
0010-03090 ESC Cathode (WTM Type)
0040-18219 ESC (WTM Type)
0190-18430 WTM Probe
0200-18109 Collar
0200-18081 Cover ceramic
0200-01009 Top nozzle
0200-18093 Side nozzle
0200-01006 Dome
0040-04650 Gas ring with (24) nozzles
0200-40156 Lift pin ceramic
Chamber B configuration:
Type: HDP Ultima plus chamber
Frequency type: Top, side and bias RF
Heater type: 0190-46458 Thermalogic board
Manometer type: Dual 10/100 TORR MKS
Throttle valve: Turbo throttle valve plus rough throttle valve
Gate valve type
3870-04276, Pendulum ISO250 Actuator 52.3
Turbo pump type: EBARA ET1600W
Turbo pump controller: 1606W TF
Turbo pump ring type:
0010-11762, CTR Ring assy, HDP-CVD Ultima plus
Chamber o ring type: KALREZ 9100
Clean method: RPS
0190-26744RPS, MKS Astroni AX7670
Clean gas: NF3
EDWARDS Rough pump interface
0010-03090 ESC Cathode (WTM Type)
0040-18219 ESC (WTM Type)
0190-18430 WTM Probe
0200-18109 Collar
0200-18081 Cover ceramic
0200-01009 Top nozzle
0200-18093 Side nozzle
0200-01006 Dome
0040-04650 Gas ring with (24) nozzles
0200-40156 Lift pin ceramic
Gas panel configurations:
Gas panel type: HP 10 Ra
Cabinet exhaust: Top exhaust
Gas panel door
Gas feed: Single-line drop (Bottom feed)
Valve type: FUJIKIN 5 Ra max
Filter: MILLIPORE Ni 10 ra max
Fitting: VCR
MFC: SEC-4400 MC (D-Sub 9 pins)
Veriflo Regulator
MKS Transducer with display unit
Gas line configuration chamber A, B, C:
Gas pallet: HDP Ultima plus
Gas feed: Single-line drop (Bottom feed)
Automatic gas line purging capability
Gas 1: SiH4, 200 sccm
Gas 2: NF3, 2000 sccm
Gas 3: SiH4 Top, 20 sccm
Gas 4: SIF4, 20 sccm
Gas 5: AR Top, 50 sccm
Gas 6: AR, 300 sccm
Gas 7: HE, 200 sccm
Gas 8: SIF4, 100 sccm
Gas 9: O2, 400 sccm
Gas 10: AR-MW, 2000 sccm
System controller:
Controller Type: Phase I Controller
Controller GFCI: 30MA GFCI
Controller UPS: Facilities ups interface
Controller electrical interface: Top feed AC cables
Controller exhaust: Top exhaust
Cursor type: Blinking cursor
Heat exchanger type:
SMC Themo chiller, INR-498-001D
Heat exchanger water fittings: Stainless steel
Generator rack:
Chamber A, B, and C top RF generator: ENI NOVA-50A
Chamber A, B and C side RF generator: ENI NOVA-50A
Chamber A, B and C bias RF generator: ENI GHW-50A
Power: 200/208 VAC, 50 Hz, 400 A
2001 vintage.
AMAT / APPLIED MATERIALS Centura Ultima HDP Reactor is an advanced tool in the world of dry-in-place etching and conformal coating. This equipment is designed to allow manufacturers to achieve a high degree of precision with minimal effort and minimal complexity. The HDP stands for High-Density Plasma, the latest plasma technology that is designed to provide the highest level of performance and cycle-time control over a variety of processes. AMAT Centura Ultima HDP Reactor meets the increasingly complex needs of semiconductor manufacturers worldwide. The system's advanced features and modular architecture enable rapid implementation, flexibility and scalability for a wide range of applications. This includes ultra-thin conformal coating, deep reactive ion etching (DRIE), electroplated copper lift-off (ECLO), and other applications. APPLIED MATERIALS CENTURA ULTIMA+ HDP Reactor offers high levels of productivity with optimized throughput and cycle-time control. Its Multi-Frequency RF plasma source and water-cooled cathode enable small feature size control and low film stress while its linear mass flow controllers enable precision control over process gases. Its modular architecture allows it to be reconfigured with minimal disruption and configured in multiple chambers enabling fast and accurate processing of a numerous parts in parallel. The HDP Reactor features latest advancements in plasma source technologies to optimize etching and conformal coating processes. Its newly designed plasma source and chamber allow for high-aspect ratio etching and coating. The HDP Reactor's advanced process control capabilities help in achieving tight process distributions, lessening the need for manual adjustment by the operators. The unit's real-time process monitoring allows for quick decisions and rapid corrective action. This machine has integrated intelligent diagnostics for fast error feedback and minimal downtime. Its online simulation capabilities enable users to quickly tweak a recipe and make necessary changes without long set-up times. Furthermore, its data output can be used to record relevant process details and improve process monitoring capabilities. AMAT / APPLIED MATERIALS CENTURA ULTIMA+ HDP Reactor is the latest and most advanced tool in the world of dry-in-place etching and conformal coating. This tool is designed for semiconductor manufacturers seeking a reliable and efficient asset with high levels of precision and repeatability. Its advanced features and modular architecture enable rapid implementation and scalability, allowing it to be reconfigured with minimal disruption and configured in multiple chambers to cover a variety of applications. AMAT CENTURA ULTIMA+ HDP Reactor provides high levels of productivity and is equipped with the latest advancements in plasma source technologies, allowing users to achieve the precision required for complex processes.
There are no reviews yet