Used AMAT / APPLIED MATERIALS Centura Ultima X #9107256 for sale
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ID: 9107256
Wafer Size: 12"
Vintage: 2003
CVD System, 12"
Wafer Shape JMF
Position A ULTIMA X HDP-CVD
Position B ULTIMA X HDP-CVD
Position C ULTIMA X HDP-CVD
Position D NA
Position A Process OXIDE - USG / STI
Position B Process OXIDE - USG / STI
Position C Process OXIDE - USG / STI
Position D Process NA
Line Voltage 208 VAC
Line Amperage PRIMARY 320A, SECONDARY 240A
(A) ULTIMA X HDP-CVD
Ultima X Chamber Options Selected Option
Integrated Process Module IPM : YES
Turbo Pump TMP-3203LMC-A1
Nozzle Type
Gas Ring 36 PORT
Top Baffle
Upper Chamber ENHANCED
Process Application USG / STI
Process Kit STANDARD
Clean Method NPP RPS (NEW POWER PLASMA)
Independent Helium Cooling ENABLED
(B) - (Z7) ULTIMA X HDP-CVD
Ultima X Chamber Options Selected Option
Integrated Process Module IPM : YES
Turbo Pump TMP-3203LMC-A1
Nozzle Type
Gas Ring 36 PORT
Top Baffle
Upper Chamber ENHANCED
Process Application USG / STI
Process Kit STANDARD
Clean Method NPP RPS (NEW POWER PLASMA)
Independent Helium Cooling ENABLED
(C) - (Z7) ULTIMA X HDP-CVD
Ultima X Chamber Options Selected Option
Integrated Process Module IPM : YES
Turbo Pump TMP-H3603LMC-A1
Nozzle Type
Gas Ring 36 PORT
Top Baffle
Upper Chamber ENHANCED
Process Application USG / STI
Process Kit STANDARD
Clean Method NPP RPS (NEW POWER PLASMA)
Independent Helium Cooling ENABLED
Gas Delivery Options
Gas Panel Selected Option
Gas Feed BOTTOM
Gas Panel Exhaust BOTTOM
MFC Type UNIT 8565 & 8565C
Gas Panel Door STANDARD
Valves VERIFLO
Display Gas Pallets
Gas Lines
Transducers NONE
Regulators NONE
Filters Millipore/Mykrolis/NAS Clean
A - (Z7) ULTIMA X HDP-CVD PALLET Selected Option
Gas Pallet
Line 1 Upper N2 PURGE
Line 1 Lower O2 - 1L
Line 2 H2 (MFC Missing)
Line 3 HE - 600SCCM
Line 4 SiH4 - 400SCCM
Line 5 AR - 1L
Line 6 HE - 600SCCM
Line 7 H2 - 1L
Line 8 SiH4 - 50SCCM
Line 9 AR - 50SCCM
Line 10 NF3 - 400SCCM
Line 11 NF3 - 15SLM
Line 12 Ar - 3L
Line 13 Lower
Line 13 Upper N2 PURGE
Plasma Detect YES
B - (Z7) ULTIMA X HDP-CVD PALLET
Gas Pallet
Line 1 Upper N2 PURGE
Line 1 Lower O2 - 1L
Line 2 H2 (MFC Missing)
Line 3 HE - 600SCCM
Line 4 SiH4 - 400SCCM
Line 5 AR - 1L
Line 6 HE - 600SCCM
Line 7 H2 (MFC Missing)
Line 8 SiH4 - 50SCCM
Line 9 AR - 50SCCM
Line 10 NF3 - 400SCCM
Line 11 NF3 - 15SLM
Line 12 Ar - 10SLM
Line 13 Lower
Line 13 Upper N2 PURGE
Plasma Detect YES
C - (Z7) ULTIMA X HDP-CVD PALLET
Gas Pallet
Line 1 Upper N2 PURGE
Line 1 Lower O2 - 400SCCM
Line 2 NF3 - 400SCCM
Line 3 H2 - 1L
Line 4 SiH4 - 400SCCM
Line 5 HE - 600SCCM
Line 6 AR - 50SCCM
Line 7 H2 - 1L
Line 8 SiH4 - 50SCCM
Line 9 HE - 600SCCM
Line 10 NF3 - 400SCCM
Line 11 NF3 - 15SLM
Line 12 Ar - 3L
Line 13 Lower
Line 13 Upper N2 PURGE
Plasma Detect YES
Mainframe Options
Process Chamber Isolation
CHAMBER A SLIT VALVE
CHAMBER B SLIT VALVE
CHAMBER C SLIT VALVE
Mainframe and FI Alignment MF AND FI ALIGNMENT FIXTURES
CFW Manifold YES
LL and Xfer Ch Vac and Vent
Mainframe Type AP MAINFRAME
SWLL Doors AP STD SWLL DOOR
SWLL Cooldown
Wafer Hoop Type WAFER HOOP
Transfer Chamber Robot Blades
Transfer Chamber Robots STD REACH DUAL BLADE ROBOT
Transfer Chamber Lid CLEAR LID
Factory Interface Options
WIP Delivery Type OHT WIP DELIVERY
Number of Load Ports 2 LOAD PORTS
Atmospheric Robots KAWASAKI 2 FIXED ROBOTS WITH EDGE GRIP(C61D-B001)
Load Port Types ENHANCED 25 WAFER FOUP
E84 Carrier Handoff UPPER E84 INTERFACE ENABLED OHT
OHT Light Curtain LIGHT CURTAIN
Operator Access Switch YES
Configurable Colored Lights YES
Light Towers
Air Intake Systems
Remote Options
Sytem Monitors Selected Option
Monitor 1 FLAT PANEL WITH KEYBOARD ON STAND
Monitor 2
Heat Exchanger Selected Option
Heat Exchanger Type NA
Umbilicals Selected Option
Heat Exchanger Hose Length
Pumps Selected Option
Pump Supplied By NA
Pump Interface Type NA
AC Racks Selected Option
Facilities UPS Interface YES
Chamber Generator Type ENI GENERATOR RACK
SMC HX H2O Connection NA
QIL HX Qty
Ch A RF Generator Type ENI GENERATOR RACK (SPECTRUM B-10513)
Ch B RF Generator Type ENI GENERATOR RACK (SPECTRUM 11002-00)
Ch C RF Generator Type ENI GENERATOR RACK (SPECTRUM 11002-00)
Heat Exchanger Cable Length
Pump Interface Cable Length
Monitor 1 Cables
Monitor 2 Cables
Missing Parts
Turbo Throttle Valve
Ch#B Gas Panel DIO Board
HDD
Currently warehoused
2003 vintage.
AMAT / APPLIED MATERIALS Centura Ultima X is a next-generation, high-throughput, wafer-sized reactor designed for semiconductor manufacturing. It is capable of handling up to 8-inch wafers and offers a wide range of process capabilities, from layering materials to processing trenches, spacers, and interconnects. The equipment is designed to meet the most advanced fabrication demands in the semiconductor industry. With its Ultima X platform, AMAT provides an integrated wafer-fabrication solution with the expanded process capability required for advanced chip development projects. AMAT Centura Ultima X has two wafer-handling chambers with a 9-kilowatt process chamber and a 3-kilowatt second-level auxilary chamber. Both chambers are connected to a common process valve station with high-vacuum seals and feature a common gas distribution system to supply process gases. The reactor's gas distribution unit is controlled by a single central automated controller and provides a reliable uniform gas distribution throughout the entire machine. The Ultra X also features an electronic isolation valve station, which helps ensure that any potential contamination associated with process gases is minimized. The Ultima X also offers a low-temperature annealing module, ensuring that wafers are processed at the lowest possible temperatures for optimum performance. The tool can also be configured with a range of additional features and accessories, including additional sensors, sputtering targets, and plasma-processing chambers. APPLIED MATERIALS Centura Ultima X is designed for compatibility with a variety of furnace designs, including horizontal and vertical hot-wall tube furnaces and multi-stage horizontal cold-wafer reactors. It features an interface that is consistent with common semiconductor control systems, making it an all-in-one integrated solution that can handle all of your fabrication needs. The Ultima X also offers a variety of advanced features, including an embed-metal module that allows you to layer additional metallization layers without having to expose the wafer to the ambient. This feature also helps reduce cycle times and make device fabrication more efficient and cost-effective. The Ultima X's advanced control systems also ensure that the process recipes and temperatures are consistent across all wafers. In conclusion, Centura Ultima X is an advanced, high-throughput semiconductor fabrication tool offering a wide range of process capabilities. The Ultima X's highly integrated platform helps create a reliable process, and its advanced features reduce cycle times and help create cost-effective wafers with reliable performance and long-lasting reliability.
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