Used AMAT / APPLIED MATERIALS Centura Ultima+ #9230338 for sale

AMAT / APPLIED MATERIALS Centura Ultima+ is an advanced plasma enhanced chemical vapor deposition (PECVD) reactor used for thin-film deposition. This equipment utilizes an advanced dual-frequency Novellus Generation4 plasma source, allowing for precise control of deposition temperatures to deposit uniformity layers down to 0.3um thick. The reactor is also able to process dielectric semiconductor and conductive metals to create low-k dielectric interconnects or metal contact barriers. AMAT Centura Ultima+ incorporates a proprietary dual-zone inductive coil design to power its 75 MHz and 13.56 MHz RF sources. This allows for improved layer uniformity and throughput, resulting in higher yields and better yields control. Its multi-lobed magnetic powered RF coils provide an excellent replication of the plasma throughout the chamber for greater temperature and layer uniformity, allowing for better transfer of materials into the substrate. The system utilizes a propriety Novellus Scrub and Drytube technologies to ensure high-quality, defect-free thin-film deposition. The scrub process uses a cascading array of multiple, low-pressure nitrogen tubes to remove all plasma by-products and contaminants from the substrate surface before the next process step. The drytube technology allows for the process gas and substrate temperature to remain consistent, thus ensuring high-quality depositions. APPLIED MATERIALS Centura Ultima+ also features an integrated end station module, allowing recipe writing, programmable metrology, and adjustable user interface options for maximum process optimization. Its advanced material handling unit enables the substrate to continuously move and rotate within the reactor chamber without interruption, enabling high-throughput production. In addition to its advanced deposition technologies, Centura Ultima+ reactor also contains a high-resolution imaging machine, allowing for precise, easy-to-understand real-time images of the process. This tool also supports process optimization, providing a powerful tool for direct monitoring and insight into process performance. Overall, AMAT / APPLIED MATERIALS Centura Ultima+ plasma enhanced chemical vapor deposition reactor offers advanced technology for the production of high-quality, uniform thin-film layers for a variety of device applications. Its advanced deposition and material handling technology combined with integrated user interface, imaging, and metrology capabilities provide an ideal asset for high-throughput production of high-quality thin-film layers.