Used AMAT / APPLIED MATERIALS Centura WCVD #9116738 for sale

AMAT / APPLIED MATERIALS Centura WCVD is a type of chemical vapor deposition (CVD) reactor used in wafer fabrication processes. The Centura is a low-pressure, high-temperature chemical vapor deposition system, used to create silicon dioxide (SiO2) surfaces on the wafers. WCVD stands for Wet Chemical Vapor Deposition, as water is used in the process. The reactor's chamber is made up of stainless steel, and is designed to hold up to 12 300mm wafers and 17 200mm wafers or mini substrates. The process occurs in a high-temperature thermal zone, with temperatures up to 900°C. Compressed air is used to provide a carrier gas to assist the vapor sublimation and transport of the active chemical species through the chamber. At the beginning of the process, the wafers are loaded into the chamber. Then, the reactor is evacuated using a vacuum pump and the chamber is heated up. The water is then heated to a vapor form and mixed with oxygen and nitrogen in the chamber. This creates hydrocarbon oxidants. These hydrocarbon oxidants react with the large surface area of the heated wafers, resulting in the formation of a uniform and dense oxide layer. The deposited SiO2 layer is highly conformal and can accommodate both flat and stepped structures. This allows for better surface area contact, which translates to better step coverage and high yield. The thickness of the deposited layer is precisely controlled by the flow rate and pressure of the reactants. Finally, once the process is complete, the wafers are unloaded from the chamber. AMAT Centura WCVD is a reliable and precise CVD reactor that is widely used in processes such as dielectric processes, nitride films, metallic films, barrier films, and at gate contacts. It is a vital piece of equipment in wafer fabrication and process technology, with its ability to provide uniform and dense SiO2 layers quickly and safely.