Used AMAT / APPLIED MATERIALS Centura WCVD #9116740 for sale

AMAT / APPLIED MATERIALS Centura WCVD is a reactor equipment designed for the deposition of thin films of insulating materials on wafers. It uses a low pressure chemical vapor deposition (LPCVD) process to deposit films of silicon nitride, silicon dioxide, and phosphosilicate glass (PSG). The system is also capable of producing polysilicon films and can be used for gate and interconnect deposition, as well as doping of various layers. AMAT Centura WCVD consists of two main components: the process chamber and the controller. The process chamber consists of a stainless steel vacuum chamber with an 8-inch wafer loading dock. The inner surfaces of the vacuum chamber have an electrostatic shield lining to provide additional protection to the wafer from electrically charged particles. Inside the chamber there are several process gases, a glow discharge source, a susceptor, and a high temperature filter. The susceptor holds the wafer in place during the deposition process and can be heated up to a maximum temperature of 1100°C. The glow discharge source is used to decompose the precursor gas. The controller is the interface between the user and the process chamber. It is connected to the process chamber and is used to operate the unit. It allows the user to set various process parameters, such as gas flow rate, wafer temperature, and plasma density. The controller also provides readouts of chamber pressure, gas flow rate, temperature, and other process data. APPLIED MATERIALS CENTURA WCVD machine is designed to run in either a manual or a semi-automated mode. In manual mode, the user has full control over the deposition process. This mode allows for the greatest flexibility in the adjusting of deposition parameters. In semi-automated mode, the tool will automatically adjust its parameters according to pre-programmed recipes. This mode requires less user supervision and allows for more uniform deposition of the film. CENTURA WCVD asset is an efficient and reliable platform for low pressure chemical vapor deposition of insulating films. It is capable of producing films of high quality and uniformity, while providing versatility in its process parameters and operating modes. This makes it an ideal choice for a variety of applications, from MEMS to solar cells and semiconductors.