Used AMAT / APPLIED MATERIALS Centura WxZ #293763999 for sale
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AMAT / APPLIED MATERIALS Centura WxZ Reactor is a highly reliable, and versatile, semiconductor processing equipment. It delivers excellent uniformity of plasma profiles and repeatability on a wide variety of films and materials. AMAT Centura WxZ Reactor is designed for both plasma etch and deposition applications. It has an environmental semiannulus that maximizes chamber height, allowing for adequate plasma clearance and thereby minimizing particle loading. The etch and deposition systems can be customized based on the application parameter requirements. The equipment also features integrated wafer stabilizing perforations that support a dynamic vacuum environment. The innovative plasma delivery system used in APPLIED MATERIALS Centura WxZ Reactor can support a variety of etch and deposition chemistries. For etch applications, the unit can accommodate a number of gases, including Ar, BCl3, CCl4 and CHF3. For deposition applications, the machine supports precursors such as silane and phosphine, as well as a wide range of organometallic compounds. The rapid wafer transfer within Centura WxZ Reactor is executed with precision to help minimize process related contamination. This is achieved through the automated wafer transport tool, which utilizes a multi-zone baking option to maintain process temperatures. It also features multiple in situ cleanings throughout the process flow. AMAT / APPLIED MATERIALS Centura WxZ Reactor provides superior uniformity of profiles and repeatability as required for both etch and deposition processes. It is designed with apertures to maximize the uniformity of ions and particles, and to ensure efficient plasma confinement. Additionally, the asset also offers a high degree of centralization, meaning that the RF power dissipates more evenly throughout the chamber to ensure an effective uniform etch profile. AMAT Centura WxZ Reactor offers an efficient and reliable semiconductor processing solution. It has an excellent environmental seal to protect the wafers from particle contamination, as well as excellent uniformity of plasma profiles and repeatability of processes. The model is highly configurable, allowing for a wide range of etch and deposition chemistries. It is a reliable, versatile, and cost-effective semiconductor processing option for industry leading film deposition and etch results.
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