Used AMAT / APPLIED MATERIALS Centura WxZ #9251453 for sale

AMAT / APPLIED MATERIALS Centura WxZ
ID: 9251453
Wafer Size: 8"
CVD System, 8".
AMAT / APPLIED MATERIALS Centura WxZ is a chemical vapor deposition reactor for thin film deposition. AMAT Centura WxZ enables the deposition of thin films to be done on a variety of different substrates as it provides a high-level of control over the parameters that govern thin film growth. It features multiple Mega cluster sources, which allow for the vaporization of separate materials, resulting in the co-deposition of materials on the substrate. The temperature zone ranges from 50 to 1000 degrees Celsius and its monochromator provides enhanced spectral control for surface coating. The system also features the high-flow gas handling system, capable of delivering a large variety of high-pressure processing gases, such as chlorine, wax, and nitrogen. APPLIED MATERIALS Centura WxZ is a highly versatile thin film deposition tool, ideal for a variety of applications ranging from metal and organic thin films, to high-k dielectrics and advanced films stacks. The tool components include a top and bottom electrode, central RF source, upper and lower orientation kit, upper and lower chamber, and support stand. The chamber offers a closable opening and multiple quartz viewports to inspect the deposition process or substrate chamber. It is equipped with multiple networked computers and automated systems that enable users to control substrate position, chamber temperature, and inert atmosphere. Centura WxZ also includes an advanced process control system that uses thermal monitoring to ensure proper substrate position, uniform process, and fast turnaround times. It offers an extended range of options for post-processing, including photolithography, ion milling and etching, thermal drying, and more. Additionally, the tool can be used for R&D purposes and for the scaling-up of production processes. Overall, AMAT / APPLIED MATERIALS Centura WxZ is a reliable and versatile thin film deposition tool intended for research and development, wafer and substrate thin film deposition, and other advanced post-processing applications. It provides a user-friendly environment with advanced capabilities and parameter control, enabling researchers to achieve high quality and reliable results.
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