Used AMAT / APPLIED MATERIALS CENTURA #146828 for sale

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ID: 146828
Wafer Size: 12"
RTP Chamber, 12" Cards: CDN491, CDN496, Gas Interlock board.
AMAT / APPLIED MATERIALS CENTURA is a high-temperature reactor used in the manufacture of microelectronic devices. It can be used to deposit a variety of films, including insulators and conductors, on semiconductor substrates. AMAT CENTURA is made out of high-temperature grade ceramics, stainless steel, and other thermal components constructed to withstand the high temperatures needed to create the desired films. It consists of a housing containing a process chamber, electron beam gun, and cooling components. Within the process chamber, there is a pedestal upon which the substrate can be placed. The substrate is heated by the electron beam gun, which bombards the substrate surface with electrons. As the beam is directed and focused across the substrate, heat is generated and the material begins to melt and eventually evaporate from the substrate surface. The process chamber features two gas sources which can be used to provide an atmosphere to the interior of the process chamber. One source of gas is directed at the film deposition area, while the other source is directed towards the cup ring, which can provide additional cooling for the substrate. The temperature inside the process chamber can reach temperatures up to 800°C. This heated atmosphere allows for film deposition to occur rapidly, allowing for higher quality films to be deposited on the substrate. Additionally, the atmosphere can be controlled with a precision of 0.1°C, allowing for a wide range of films to be deposited depending on the desired outcome. APPLIED MATERIALS CENTURA's size and weight make it ideal for handling in the cleanroom environment. It is capable of handling substrates up to 200 mm in diameter and features an easy to use LCD screen for controlling the processes within the process chamber. CENTURA is a high-temperature reactor best suited for the manufacturing of micro devices with superior quality films. It is capable of withstanding temperatures up to 800°C, and can provide precise control of the process atmosphere with a precision of 0.1°C. Additionally, it is easy to install in the cleanroom environment, and can accommodate substrates up to 200 mm in diameter.
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