Used AMAT / APPLIED MATERIALS CENTURA #293767195 for sale

AMAT / APPLIED MATERIALS CENTURA Reactor is a high-performance reactor that offers powerful process capabilities for thin film deposition and wet etch applications. It combines AMAT standard process module configurations with advanced features that allow users to optimize their processes for higher productivity and precision. AMAT CENTURA is a single wafer, plasma enhanced, chemical vapor deposition (PECVD) equipment. It utilizes both variable-frequency and direct current (DC) power supplies to enable thin film deposition of a variety of semiconductor materials. APPLIED MATERIALS CENTURA has five process modules—three plasma etch chambers, one etch/strip chamber, and one deposition chamber—each of which have adjustable height, pitch, and tilt to ensure uniform process results. CENTURA's plasma etch chambers are designed to provide high-performance etching of photoresists, metal layers, and other materials. They use radio frequency (RF) plasma power sources to generate the plasma necessary for etching. The etch/strip chamber enables both etching and stripping of photoresists and organics. It's equipped with an adjustable gas delivery system, which can help optimize the etch rate of etchants. AMAT / APPLIED MATERIALS CENTURA's deposition chamber is where the thin film deposition is performed. It's equipped with dual-frequency RF generators to power its magnetron coaxial DC source for high-precision film thickness control. It also has a reactive RF-DC biasing unit that provides a uniform bias over the wafer surface. The biasing machine can also be used to enable in-line processing. In addition to its high-performance process capabilities, AMAT CENTURA also features advanced safety features such as an isolated plasma bulkhead, vent tool, and comprehensive interlocks to help protect users from potentially hazardous exposure. Overall, APPLIED MATERIALS CENTURA Reactor is a powerful, high-performance asset designed to provide users with an optimized solution for thin film deposition and wet etch applications. Its customizable process modules, precise film thickness control, and comprehensive safety systems make it an ideal choice for users looking for maximum performance and stability.