Used AMAT / APPLIED MATERIALS CENTURA #9047762 for sale

AMAT / APPLIED MATERIALS CENTURA—a highly reliable, cost-efficient, reactive processing tool—is a substantially improved equipment for high-volume deposition and protective oxide etch rates. This system utilizes advanced PECVD technology to deliver high process headroom and cost-effective, high yield processing for multiple semiconductor materials. AMAT CENTURA unit is suitable for the fabrication of BiCMOS wafers and performs both deposition and etching, allowing for the fabrication of ultra-thin, high density dielectric films that are critical in the production of small, dense and complex semiconductor components. Furthermore, its high deposition rates, superior uniformity over large areas, economical processes, and real-time process monitoring make it an ideal machine for large-scale production of complex patterns suitable for ultra-scaled devices. The unique advantages of APPLIED MATERIALS CENTURA tool include its patented Advanced Plasma Engineering (APE) technology, which results in high quality and uniform plasmas, faster deposition rates and surface quality improvement due to better control over the plasma chemistry. Its proximity effect compensation technology offers improved step coverage by controlling the bias to optimize the deposition rate and reduce errors. The robust chambers and innovative side wall cooling management techniques ensure uniformity of deposition over larger wafer sizes. CENTURA asset is capable of simultaneously processing two wafers of 6-inch diameters, allowing for cost-effective, high-volume deposition and protection oxide etch rates. The Titan CVD tools are specially designed for advanced patterning, offering superior conformality and superior uniformity anywhere on the wafer. It supports both oxide and nitride CVD processes and can handle a wide range of advanced dielectric and metal films. AMAT / APPLIED MATERIALS CENTURA model is powered by the novel AMAT software, which provides highly accurate and intuitive process control and monitoring to prevent escape defects and reduce yield loss. AMAT CENTURA equipment has been extensively used in the fabrications of ultra-scaled devices and integrated circuits and is highly suitable for advanced CMOS applications. This is attributed to its capability to efficiently etch and deposit precise and uniform thin films suitable for ultra-scaled devices. Moreover, the elevated pressure and high pressures low temperature (HPLT) process of this system make it the best platform for dry etching, creating ultra-smooth surfaces with low surface defects. In conclusion, APPLIED MATERIALS CENTURA is a state of the art unit that offers superior process control and high yield results for high-volume deposition and protection oxide etch rates. Its Advanced Plasma Engineering (APE) technology and proximity effect compensation technologies offer improved step coverage, uniformity and controllability, improved dielectric and metal film deposition and low surface defects. These features make it perfect for the fabrication of advanced CMOS applications.