Used AMAT / APPLIED MATERIALS CENTURA #9293686 for sale

AMAT / APPLIED MATERIALS CENTURA is a high-density plasma (HDP) reactor that utilizes a unique combination of high frequency, alternating current (AC) and intense, thermalized H2 plasmas to create highly reliable, high-performance wafers. AMAT CENTURA HDP reactor uses the combination of a large-area, multi-wafer support platform with a high-temperature ceramic heating system to create a process window capable of achieving ultra-narrow critical dimensions and concurrently deposition of advanced materials. This reactor features a rapid thermal cycle for rapid process optimization, with adjustable gas flow capability and advanced process monitoring. APPLIED MATERIALS CENTURA reactor also features vacuum chamber heating to minimize aberrations to samples, as well as chambers with various pressures and temperatures that can be adjusted to meet the desired process recipes. The reactor has unique multi-wafer loadlock zone that can accommodate wafer sizes up to 300mm diameter and also enables the user to load and unload multiple wafers in a single batch. Additionally, special electrostatic chuck and active stabilization offers unrivaled uniformity to maximize yield with minimal process overhead. CENTURA reactor has the flexibility of applying any desired plasma process for timing and etching. It enables the user to employ specific recipes with different gas mixes, pressures, and RF power levels to produce diverse structures. It also provides effective etching depth, high anisotropy, and low surface roughness. The engine of AMAT / APPLIED MATERIALS CENTURA is an AC coupled Inductively Coupled Plasma (ICP) source, suitable for both Plasma Enhanced Chemical Vapor Deposition (PECVD) and etch processes for both silicon and compound semiconductor materials. The ICP source in AMAT CENTURA reactor delivers very high density plasma, and can also be tuned to provide good uniformity on each wafer across 4-inch and 12-inch wafer quantities. APPLIED MATERIALS CENTURA reactor utilizes the unique multiwafer loadlock zone which minimizes wafer-to-wafer non-uniformities and maximizes process data, throughput and profitability. It also has an automated chamber access capability that eliminates the need to open the chamber during operation, ensuring that the process parameters remain stable. Additionally, the unique multi-wafer support platform in CENTURA reactor is optimized for wafer area and uniformity, providing noticeably improved yield and throughput. In conclusion, AMAT / APPLIED MATERIALS CENTURA reactor is the perfect solution for demanding etching, deposition and process optimization. With its high-performance capability and advanced features, AMAT CENTURA reactor can provide ultra-fast processing for a wide range of applications. With its broad process scalability, easy-to-use recipes, and high-density plasma, APPLIED MATERIALS CENTURA reactor is the ultimate tool for tackling extreme process challenges.