Used AMAT / APPLIED MATERIALS Chamber for Endura CL #293660732 for sale

AMAT / APPLIED MATERIALS Chamber for Endura CL
ID: 293660732
Wafer Size: 12"
12".
AMAT / APPLIED MATERIALS Chamber for Endura CL is a specially designed reactor used for the application of chemical vapor deposition, or CVD, in semiconductor manufacturing processes. This high-performance chamber offers a wide variety of process capabilities, allowing chipmakers to create reliable and durable semiconductors. This reactor chamber features an intense gas-flow equipment and advanced thermal control systems, allowing for optimal and precise control of the deposition process. These same systems enable precise temperature and pressure control, chemical consistency, and minimal contamination. The stainless-steel chamber also features an isolated dual-plenum design, eliminating the need for a blower. This reduces pressures. AMAT Chamber for Endura CL also uses a Multi-Zone process, which ensures that each process zone is properly equipped with the right environment, supplies, and control protocols. This ensures a uniform deposition rate and a predictable process. The chamber also features an advanced showerhead design to ensure homogeneous plate-parallel and gaseous distributions, as well as a 16-section plasma-arc nozzle for uniform distribution of precursors. The chamber has an overall chamber size of 6.8 (Length) x 5.2 (Width) x 6 (Height) feet and a weight of 9,500 lbs. It can be site mounted in two alternate configurations, either In-Line or Standalone, and is designed for easy serviceability with advanced access provided through multiple ports and diagnostic panels. APPLIED MATERIALS Chamber for Endura CL has proven its safety with the exclusive Under Pressure Enhanced Safety system. This prevents chamber overpressure events from leaving the operating range, as well as protecting the vacuum unit and chamber components. The overall design of Chamber for Endura CL makes it a valuable tool for high-yield chip manufacturing. Its sophisticated designs and technologies make it the machine to beat for chemical vapor deposition processes.
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