Used AMAT / APPLIED MATERIALS Endura 2 #293642693 for sale

AMAT / APPLIED MATERIALS Endura 2 is a high-powered advanced plasma etch equipment designed for use in a wide range of critical applications, such as the fabrication of 3D structures on next-generation semiconductors. This versatile reactor is configured with high-throughput ionization source technology and features an impressive combination of a proprietary APEX™ (Advanced Plasma Extractor) and Duo-ETCH® (dual ion source capability) for improved substrate coverage and precision etching. In terms of configurability, AMAT Endura 2 offers manufacturers the highest degree of flexibility for different process recipes and parameters. It also offers an advanced 10-chamber load-lock solution that can accommodate up to 10 wafers at a time for extremely precise handling. The FASSC® load-lock technology ensures accurate handling, tracking, and monitoring of wafers throughout the process. APPLIED MATERIALS Endura 2 is designed to provide superior etching precision, unmatched throughput and critical process longevity across a variety of substrates, from simple to complex. Its combination of APEX™ and Duo-ETCH® technology enables efficient multi-chamber control and process synchronization across all chambers simultaneously. This eliminates a lot of the manual tracing and monitoring, which makes the setup process and etching process faster and more reliable than ever before. In terms of system control, Endura 2 reactor is integrated with a comprehensive suite of optimization, analytics, and analysis features. Its monitoring capabilities allow engineers to keep track of the etching process from start to finish, minimizing waste and improving yields. The unit's powerful real-time inspection and data analysis features also allow for detailed feedback that can be used to optimize the etch process while ensuring substrate uniformity and precision etching. The robot-assisted AMAT / APPLIED MATERIALS Endura 2 dry-vacuum load-lock machine ensures secure handling of delicate wafers and uniform cleaning. The automatic cleaning routine with BVAVS (Backside Vacuum Abrasive Vacuum Tool) eliminates the need for manual loading and unloading, resulting in improved operation efficiency and reduced contamination risks. AMAT Endura 2's intuitive user interface and easy-to-use software interface further help streamline the setup process by allowing users to quickly save and replicate etching recipes. In addition, APPLIED MATERIALS Endura 2 is equipped with an advanced automated remote monitoring and data collection asset, which enables users to monitor the model's performance in real time. This equipment allows users to remotely troubleshoot any process anomalies or anomalies with an accurate view of the system's health. The reactor also features integrated traceability management capabilities that help users to keep track of etch results from the start to the end of the process. Endura 2 is a powerful advanced plasma etch unit that is designed for demanding process and application requirements. It's high-throughput technology and proprietary APEX™ and Duo-ETCH® capabilities enable efficient etching of complex substrates while its automated remote monitoring and data collection machine help ensure precise and reliable process yields.