Used AMAT / APPLIED MATERIALS Endura 2 #293827409 for sale

ID: 293827409
Vintage: 2016
Physical Vapor Deposition (PVD) system Part number / Description 0410-10000 / System, 12" FAM300E2 / MDP E2 Endura, 12" 0415-10014 / - 0415-10346 / Impulse AIN 0415-10046 / Dual mode degas 0415-10054 / RGA Manual valve 0395-09095 / Infopad pos A or B 0395-09026 / E78 Ionizer 0395-09073 / Upper E84 Data logging sensors and cables 0395-09071 / TIRIS with RF E99 Carrier ID 0395-00114 / Operator access switch 0395-09056 / Remote flat panel monitor on stand 0395-09007 / Effective 75 Feet with 66 Feet 0415-10080 / Umbilical’s 75 Feet Mainframe to equipment rack TR-STND-22 / Standard training package WT-12MO / Standard 12-month warranty 0415-10082 / FIF Generic kit 0415-10089 / Lifting aids 0415-10090 / Maintenance lift 0395-09029 / FI Align and levelling tool kit 0395-09039 / Ionizer calibration tools 0395-09055 / Outrigger levelling tools 0395-09031 / FI Service lift 0395-09123 / Load Port Service Tool (7) Salop 0395-09013 / Controller recovery tools 0395-09066 / YAT Teach tools, 12” 0415-10288 / Cons kit - Impulse 0415-10313 / Shutter disk, ESC, Ti, AL Arc spray 2016 vintage.
AMAT / APPLIED MATERIALS Endura 2 reactor is a revolutionary etching and deposition chamber designed for semiconductor processing. It is one of the latest breakthroughs in AMAT SPECTOR series of advanced chemistry products. AMAT Endura 2 is the second-generation etching and deposition platform, and it features several innovations that set it apart from the competition. APPLIED MATERIALS Endura 2 features a unique dual-pumped configuration that enables the chamber to achieve unprecedented chamber pressures and process parameters. It also features reduced chamber volume and low chamber profile, which drastically reduces the total surface area available for deposition for a given wafer size, resulting in higher utilization and lower cost-per-wafer. The reactor is equipped with two chambers: the etching chamber and the deposition chamber. The etching chamber uses balanced, real-time reactive ion etching technology to form feature profiles with accurate control of aspect ratio and topography. The deposition chamber uses inductively coupled plasma (ICP) sources to deposit thin films with tight thickness uniformity and precise composition control. Endura 2 also features automated wafer handling mechanisms, such as a robot arm that can transfer wafers accurately and efficiently between chambers and a wafer mapping equipment that identifies individual wafers and tracks their positions in the process. It also features sophisticated software to monitor and optimize the parameters of the etching and deposition processes. AMAT / APPLIED MATERIALS Endura 2 comes with an advanced system for data acquisition and analysis. This advanced unit provides real-time monitoring, as well as post-processing analysis, of etching and deposition parameters. AMAT Endura 2 machine is designed with high safety standards. It has several redundant safety features, such as emergency shut-off systems, emergency venting systems, and advanced monitoring systems. These features ensure the safety of personnel and equipment. APPLIED MATERIALS Endura 2 is a revolutionary etching and deposition chamber that sets new standards for the semiconductor processing industry. It features a unique dual-pumped configuration, low chamber profile, and automated wafer handling mechanisms, allowing it to achieve unprecedented levels of process control and precision. Additionally, its advanced data acquisition and analysis tool provide actionable insights into process parameters. Safety and reliability are further ensured by its advanced safety features. As a result, Endura 2 is the ideal choice for low-cost, high-performance, and efficient semiconductor processing.
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