Used AMAT / APPLIED MATERIALS Endura 5500 HP #9223524 for sale
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ID: 9223524
Wafer Size: 8"
PVD System, 8"
Multi-chamber sputtering system
Process: Copper
Dry pump type: EBARA AA40W (System)
LLA
LLB
(2) Al
(2) Ta PVD
(2) PCII
(2) DG
System controller
SMIF System:
(2) LPT 2200
(2) Load locks
Handler system:
Buffer Hp
Transfer VHp
(2) Hoisters
Process chambers:
(2) ImpTa
(2) ClampAl
(2) PcII
(2) Degas
Main AC
NESLAB Chiller
(3) General racks
(2) Compressors
(4) EBARA Pumps
Chamber 1: B101 IMP Ta
Shutter disk
Body type: WB
Source type: Vectra IMP
Magnet type: RH-2
MFCs: Ar 140sccm
DC Generator: ADVANCED ENERGY MDX-L6
RF Generator:
ADVANCED ENERGY HFV8000 (RF Coil)
COMDEL CX-600S (AC Bias)
RF Match:
HE
BIAS
Vectra IMP
010CAP 2MHz (RF Coil)
13.56 MHz (AC Bias)
Cryo Pump: CTI On-Board 8F
No turbo pump
Chamber 2 & 3: Clamp Al
Body type: WB
Source type: 12.9''
Magnet type: Al A, 12.9''
DC Generator: ADVANCED ENERGY MDX-L12M
MFCs:
Ar 140sccm
Ar-H 70sccm
Cryo pump: CTI On-board 8F
No shutter disk
No RF Generator
No RF Match
No turbo pump
Chamber: 4 B101 IMP Ta
Shutter disk
Body type: WB
Source type: Vectra IMP
Magnet type: RH-2
MFCs: Ar 140 sccm
ADVANCED ENERGY MDX-L6 DC Generator
RF Generator:
ADVANCED ENERGY HFV8000 RF Coil
COMDEL CX-600S AC Bias
RF Match:
HE
BIAS
Vectra IMP
010CAP 2MHz (RF Coil)
13.56MHz (AC Bias)
Cryo pump: CTI On-board 8F
No turbo pump
Chamber A & B: Cool down
Dry pump: EBARA AA20N
Pedestal type: Clncool
Chamber C & D: PCII
Process: Etch
PK Type: PIKII Pinless
Dry pump: EBARA AA20N
Turbo pump: LEYBOLD TMP
RF Generator:
COMDEL CPS1001S 13.56MHz
RFPP LF10A 400KHz
RF Match: PC II 13.56MHz
MFCs:
Ar 28sccm
Ar 420sccm
No DC Generator
No cryo pump
Chamber E & F: O/D
Degas type: Standard
Buffer & Transfer:
Cryo pump: CTI On-board 8F
Robot type: HP
Load lock:
Body type WB
Venting & pumping mode:
Soft slow
Fast
Wafer mapping: Standard
No scrubber / CDO
Heat exchanger: NESLAB III (PVD Chm)
Cryo compressor: Water cooled 9600
CIM Linked.
AMAT / APPLIED MATERIALS Endura 5500 HP Reactor is a compact, automated CVD tool designed to reliably do high-precision processing for advanced materials applications. This reactor boasts unparalleled speed and accuracy capabilities with its micron-level accuracy and vertical scanning time of up to 10 minutes. AMAT Endura 5500 HP is equipped with a robustly designed chamber that is well-suited for large batch jobs as well as the most complex assignments. It utilizes dual-frequency plasma to enable optimized deposition capabilities under a wide range of process conditions. The dual-engines, the high-performance RF power modules, the multiple independent deposition sources and the adjustable chamber temperature provide a highly repeatable suite of process parameters for the most advanced applications. The Endura's stand-out features include its powerful control and automation capabilities. It has an advanced robot arm with integrated end-effectors that allows it to precisely control the trajectory of the wafer carrier through the chamber. The Endura also offers a user-friendly Graphical User Interface system that allows for quick parameter changes and the ability to monitor the process in real-time. The motorized chamber elements, such as the robot arm, the quartz chamber and the gas delivery systems, enable APPLIED MATERIALS Endura 5500 HP to be infinitely adjusted for ultra-precise thin film functions. This reactor can be used for deposition processes using organo-metallic reagents, such as ozone based processes, as well as deposition processes using solid phase precursors. Endura 5500 HP is designed to provide outstanding reliability and performance. Its advanced features provide flexible process development capabilities, including process profiling, diagnostics, remote monitoring and data logging. The reactor also has various safety features to protect the operators and the system itself from potential hazards. AMAT / APPLIED MATERIALS Endura 5500 HP is an efficient and reliable reactor that can handle the most challenging deposition applications. It is an ideal choice for advanced materials applications, allowing for the production of high-quality films and surfaces at unprecedented yields.
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