Used AMAT / APPLIED MATERIALS Endura 5500 SIP EnCoRe #158915 for sale
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ID: 158915
Wafer Size: 8"
Vintage: 2007
System, 8"
Number of Chambers: 5
Process capabilities:
Hot Al, SIP TTN, SiP Encore Cu, SIP Encore Ta(N) and CleanW
Application: Copper Barrier Seed
Wafer size range: 6" to 8"
Wafer set size: 8"
Chamber 1:
Enhanced Hot Aluminum
Standard Body Chamber
Mech Clamped chuck, Ti clamp ring
CTI Onboard Cryo, fast regen, low vibe
Magnet type: 12.9" Al A,P/N: 0020-26822
Chamber 2:
Ti Nitride
Wide Body Chamber
Elec. Chuck: Bias MCS ESC, SST cover ring
Wafer bias power supply, 13.56MHz 600 W,
CTI Onboard Cryo, fast regen, low vibe
Magnet type: SIP REV2, P/N: 0010-04065
Chamber 3:
SIP Encore Cu
Wide Body Chamber
Elec. Chuck: SLT FDR E-Chuck, Ti cover ring, cryo chilled
Wafer bias power supply, 13.56MHz 1250 W,
CTI Onboard Cryo, fast regen, low vibe
Magnet type: LP 8.8, P/N: 0010-12864
Chamber 4:
SIP Encore Ta(N)
Wide Body Chamber
Elec.Chuck: SLT FDR E-Chuck, Ti -Arc-Sp
Wafer bias power supply, 13.56MHz 600W, ICE RF Match
CTI Onboard Cryo, fast regen, low vibe
Magnet Type: Encore Rev 2, P/N:0010-14875
Chamber 5:
CleanW PVD
Wide Body Chamber
Elec. Chuck: MCS+ ESC, SST-Arc-Sp cover ring
CTI Onboard Cryo, fast regen, low vibe
Magnet type: PVD WII, P/N: 0010-11925
Interface Type: SECS RS-232
Elevator Type: Universal Manual with Rotate
External Cooling: Water Cooled
Accessories:
(3) CTI 9600 Compressor, p/n: 3620-01389, water cooled
(3) CTI Onboard Terminal, p/n: 3620-01553
(2) Neslab System III Heat Exchanger
(1) CTL Inc subzero chiller, Model: BCU-L310F1-AMAT
(1) Toyota T100L Dry Pump
(2) Toyata T600 Dry Pump
Other Information:
Buffer Chamber Position "A": Pass thru with clear plastic lid
Position "B": Cooldown with temp monitor
Position "D": Reactive Preclean, Leybold TMP
Position "E" Orienter degas with temp feedback
Position "F" Orienter degas with temp feedback
Wide Body Loadlocks with variable speed soft vent
VHP Transfer Robot with HTHU compatible blade
HP+ Buffer Robot with with original metal blade
50' Cable harness
SMIF Integrated Tool Control
#NB: Asyst SMIF Loader sold as option.
Power Requirements: 480 V, 500.0 A, 60 Hz, 3 Phase
CE Marked: yes
2007 vintage.
AMAT / APPLIED MATERIALS Endura 5500 SIP EnCoRe is a state-of-the-art reactor designed to provide superior performance and simplified operation in a variety of module processes - from efficient Si epitaxial growth, selective epitaxial growth (SEG) to oxidation and silicon nitride deposition. The 5500 SIP EnCoRe utilizes AMAT Next Generation Thermal Control (NTCT) technology, which calms process variability by allowing for comprehensive control of the entire thermal range. This is achieved via NTCT's advanced temperature control algorithms, allowing the reactor to accurately regulate the process chamber from 4°C up to 1200°C in seconds. The 5500 SIP EnCoRe is powered by its proprietary inductively coupled plasma (ICP) source, designed to maximize process flexibility and control. The ICP system can be used to create highly homogenous plasma sheets, with process stability maintained across varying substrate sizes. These features allow the user to adjust the power, total pressure, and subscription bias based on the application requirement, guaranteeing adaptability and reliability. The reactor also features a loadlock design that allows fora rigid seal between the transfer chamber, loading chamber, and the process chamber. This reduces potential contamination, the risk of particle generation, and simplifies the transition between different processes. Additionally, the 5500 SIP EnCoRe extends tool life with a patented erosion-mitigation mechanism, which keeps the reactor chamber clean via rotation and adjustable speed. For process monitoring, the 5500 SIP EnCoRe has several built-in sensing capabilities. The design includes multiple sensors and a detection system, which allow for radiometric temperature readings, base pressure monitoring, deposition layer thickness measurement, and low gas usage notification. All these settings are automated and tracked, ensuring a tailored approach for users' respective applications. AMAT Endura 5500 SIP EnCoRe is the ideal reactive-ion etch tool for optimizing process flexibility and quality control. Offering superior temperature accuracy, low contamination, and integrated detection, the system consists of a suite of advanced features designed to enhance process control and reduce costs.
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