Used AMAT / APPLIED MATERIALS Endura 5500 #293742979 for sale

ID: 293742979
Wafer Size: 6"
Vintage: 1994
PVD System, 6" 1994 vintage.
AMAT / APPLIED MATERIALS / AKT Endura 5500 is a high-performancephysical vapor deposition (PVD) reactor used for thin-film deposition on semiconductor wafers. This advanced equipment is used in the manufacture of semiconductor devices enabling various electronic devices and components. AKT Endura 5500 PVD reactor is well suited for a wide range of processes including AlSi, Ti, TiCN, AlN, Titanium Silicon Nitride (TiSiN) and other metals. It features a cutting-edge design that incorporates next generation process chemistries and a smart, scalable control platform. The reactor is equipped with a temperature controlled substrate holder, low-pressure options, and other advanced features that optimize film quality and uniformity. AMAT ENDURA 5500 utilizes a multi-zone deposition technique to deliver films with homogeneity throughout the wafer. This process consists of different gaseous flows of plasma etching, electron cyclotron resonance (ECR) deposition, closed-loop feedback controls, and other technologies. Its advanced dual-gas capability enables higher deposition rates with excellent uniformity. The reactor's process control system uses intelligent modeling techniques to anticipate process disruptions and incorporate corrections into process adjustments. This allows the system to ensure highly precise uniformity and homogeneity of the final films. It also has multiple options for plasma activation that help ensure adhesion and improved film properties. AMAT / APPLIED MATERIALS / AKT ENDURA 5500 provides excellent process repeatability, uniformity, and throughput. With this reactor, users can deposit sub-50nm films across a wafer, up to 11 inches in diameter. Additionally, its patented closed-loop feedback controls allow users to adjust the process settings in real time and achieve the desired thin-film deposition results. APPLIED MATERIALS ENDURA 5500's closed-loop feedback control, combination of novel technologies, and precise process repeatability make it a popular choice for PVD applications. It offers superior performance for many types of thin-film applications and is suitable for high-volume production.
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