Used AMAT / APPLIED MATERIALS Endura 5500 #9015795 for sale

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ID: 9015795
PVD System, 8" Cleanroom Interface: Endura VHP Front Panel PVD Endura Type Controller PVD Endura Type Remote Generator Rack Secondary Generator Rack: (2) 9600 System Cryo Compressors Transfer & Buffer Lid Hoist CE Mark CHAMBER A Pass-Through Chamber Quartz Viewport Lid CHAMBER B Cooldown with Temperature Monitor Quartz Viewport Lid O2 Manifold CHAMBERS C/D (2) Reactive Preclean (RPC) Chambers Preclean UHV Pump Options: Leybold TMP Preclean Smart Pump Interface Kit CHAMBER E/F (2) Orienters with Enhanced Degas TRANSFER ROBOT VHP Robot BUFFER ROBOT HP Robot SYSTEM PUMP OPTION CTI Enhance Fast Regen Low Vibration 3-Phase Cryo - One Each for Transfer & Buffer Chambers SYSTEM PUMP/INTERFACE COMBINATION System Smart Pump Interface Kit (Subject to Availability) CHAMBER 2 Refractory Widebody PVD SIP Ta(N) Chamber Power Supply Options: 24 kW Two Box, Power Supply Mini Panel PVD Wafer Chuck Options: SZBESC style e-chuck Shield Material: Stainless Steel two-piece CHAMBER 3 Widebody PVD SIP Cu Chamber PVD Power Supply Options: 40kW 2 box with Arc Out, Power Supply Mini Panel PVD Wafer Chuck Options: SLT ESC Ceramic Cover Ring Both CHAMBER 2/3 have the following options: PVD UHV Pump Options CTI Enhanced Fast Regen Low Vibration 3-phase Cryo Wafer Bias Power Supply: IMP 13.56MHz Bias Power Supply H/W 3-Position Gate Valves Standard Cryo Restrictors Chamber Conditioning Options: Mag-Coupled Shutter Configuration: Endura Electra Cu.
AKT/AMAT / APPLIED MATERIALS / AKT Endura 5500 reactor is an industrial-grade equipment designed for precision deposition of functional films such as dielectrics and metal-containing films for multiple device types. Depending on the application requirements, the system can be used for a variety of deposition methods such as atomic layer deposition (ALD), chemical vapor deposition (CVD), and physical vapor deposition (PVD). The reactor consists of two main chambers: the main chamber and the showerhead chamber. The main chamber is where the deposition process takes place. It is equipped with three 300mm capacitively coupled plasma sources, three gas delivery systems, and six RF bias sources. The gas delivery unit can distribute up to 100 gases at two different pressures. The RF bias sources enable the optimization of deposition rate and film properties. The showerhead chamber is used for pre-cleaning of wafers before and after deposition. The chamber is equipped with an adjustable-height automated robotic arm which can be used to hold the wafer during the pre-cleaning processes. The chamber can be pressurized with up to 500 mtorr of nitrogen or argon. AKT Endura 5500 reactor machine is designed for low-temperature deposition of films from 25°C to 650°C. It has an advanced temperature control tool that offers precise temperature control to 0.1°C. The asset is equipped with three load-lock transfer chambers which can store up to 60 wafers each. It has a power-saving mode which helps conserve energy while idle. The model is designed for high-volume production with a wafer cycle time of 12 minutes. It also has a wafer-by-wafer film thickness monitoring feature which provides real-time feedback on the deposition process. Furthermore, AMAT ENDURA 5500 reactor equipment is designed with safety in mind and has an emergency shut-off option. It is equipped with a built-in breakout detection feature which ensures that all gases and plasma remain inside the chamber at all times. Additionally, the system is designed with a time-controlled door unit which allows only one operator at a time to enter or leave the chamber. Overall, AMAT/AMAT Endura 5500 reactor machine is a high-precision tool that offers superior film properties for multiple device types. It is ideal for low-temperature precision deposition processes and is equipped with enhanced safety features for maximum operator protection.
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