Used AMAT / APPLIED MATERIALS Endura 5500 #9036092 for sale

Name: AMAT / APPLIED MATERIALS Endura 5500
Brand: AMAT / APPLIED MATERIALS
SKU: 9036092
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Reactors

Manufacturer

AMAT / APPLIED MATERIALS

Model

Endura 5500

ID: 9036092

PVD System, 8" Wafer handling: SMIF Front panel type: wide body Software version: B88810 Single board computer in controller: Yes Ion gauges: Yes Robots (standard, HP, HP+, VHP, etc): Buffer robot: HP+ Transfer robot:HP+ Blade material: Metal Blade material: Metal Load Lock: Wide Body Narrow Body: tilt-out Index handler type: Loadlock vents: N2 vent Basic Chamber setup: (PC II, Cooldown, O/D, pass through, CVD, other - w/o details) A: Cool down B: Cool down C: Pre clean II D: Pre clean II E: Orient / Enhanced degas F: Orient / Enhanced degas Process: VECTRA IMP Ti Platform: Endura RF coil power supply: Advance Energy HFV 8000 Chamber temperature: Heater 100°C - Bake 30% Pump Type: CTI 8F Enhanced Fast Regen Low Vib MFC #1: Argon Heater MFC #1 type / size: Stec SEC-4400M 50 Sccm MFC #2: Argon Final MFC #2 type / size: Stec SEC-4400M 100 Sccm Source type: Vectra IMP Target type / vendor: D-Bond 0.25" - Honeywell Target part # 7VX00236 Coil part # 7VX20266 Magnet type / part number: Type RH-2 P/N 0010-21676 Ar Psi: 20 PSI Power supply: MDX 12KW Shutter: Linkage Heater: Original 4F Process Kit (type/desc): IMP Process Kit Version 4.5 Upper Shield Part No: 0020-22498 Lower Shield Part No: 0020-22499 Shield Clamp Kit Part No: 0240-25440 DC Bias Hardware Kit PN: 0240-20021 Process: CVD TiN Platform: ENDURA Chamber temperature: 400°C Chamber type: TxZ HP+ Heater: AMAT P/N 0010-03244 Pump Type: ALCATEL 602 P HX: AMAT 1 HX temperature: 60°C MFC #1: Argon Edge Purge MFC #1 type / size: Stec SEC-4400M 3000 Sccm MFC #2: Argon BTPur MFC #2 type / size: Stec SEC-4400M 2000 Sccm MFC #3: He Carrier MFC #3 type / size: Stec SEC-4400M 500 Sccm MFC #4: N2 Dil MFC #4 type / size: Stec SEC-4400M 1000 Sccm MFC #5: He Dil MFC #5 type / size: Stec SEC-4400M 1000 Sccm MFC #6: N2 MFC #6 type / size: Stec SEC-4400M 1000 Sccm RF Power supply: ADVANCE ENERGY PDX 900-2V HE carrier pressure: 18 PSI HE DIL pressure: 30 PSI Ampole temperature: 50°C Gas line temperature: 60°C Hot Box: 70°C CVD Ion gauge: Absent Process Kit (type/desc) INSERT LINER EXHAUST TXZ 200MM: 0021-02469 RING, LOWER, ISOLATOR: 0021-02155 RING, MIDDLE, ISOLATOR: 0021-02156 EDGE RING, PURGE HEATER, 200MM TXZ: 0021-03094 SCREW, CENTERING PURGE HEATER 200MM TXZ: 0021-07418 OUTER SHIELD W/O WINDOW, TXZ CHAMBER: 0021-03980 INNER SHIELD HP TXZ IMP. UNIF.: 0040-06127 PIN, LIFT, TXZ HEATER: 0200-01798 PLATE,BLOCKER,TXZ 200MM: 0021-35744 FACE PLATE, BKM3 TXZ 200MM: 0040-01878 CHAMBER INSERT 200MM TXZ CIP: 0200-00261 ISOLATOR, SIN, ENH, PUMPING LID, DXZ GECO: 0200-10163 TUBE GAS FEED: 0020-31425 LID LINER, HPTXZ: 0200-00689 Process: PVD TiN Platform: ENDURA Ch temp control: Without temp control Chamber type: WB Pump Type: CTI 8F Enhanced Fast Regen Low Vib MFC #1: Argon MFC #1 type / size: Stec SEC-4400M 100 Sccm MFC #2: N2 MFC #2 type / size: Stec SEC-4400M 200 Sccm Source type: G-12 Target type / vendor: D-Bond 0.35" - Praxair Target part #: 7VX00135 Magnet type / part number: Type G-12 P/N 0010-20768 N2 Psi: 20 PSI Ar Psi: 20 PSI Power supply: MDX - L12M - 650 Shutter: Linkage Heater: SST Pedestal Unclamped 101 Process Kit (type/desc): Shield Mounting G12 btn hd Upper Shield Part No: 0020-25730 Lower Shield Part No: 0020-25077 Pedestal Part No: 0021-22028 Cover Ring Part No: 0020-24914 Process: Pre-clean Pedestal type: Preclean II Pik1 Power supply 1: 400 KHz Power supply 2: 13.56 MHz Gasline fittings: VCR Loadlock fittings: VCR MFC type: Millipore / STEC Paste chamber: NA Chamber cryo pump type: CTI 8F Enhanced Fast Regen Low Vib Umbilicals: Mainframe to controller: ~25 ft Mainframe to generator racks: ~25 ft Mainframe to cryo compressor: ~25 ft Main AC to system controller/sys. AC: ~25 ft Syst cont/sys AC to primary Gen rack: ~25 ft Main AC to primary generator rack: ~25 ft Main AC to pump frame: ~25 ft Main AC to Neslab heat exchanger: ~25 ft Monitor cable: ~25 ft Monitor2 cable: ~25 ft Monitor3 cable: ~15 ft EMO button guard ring: Yes Water leak detector: yes Buffer and transfer lid hoist: Yes Support Equipment: AMAT 0 Heat exchanger 0010-76467 Cryo compressors: (2) CTI Cryo pump 1 8135900G001 Neslab with resistivity meter Soft copy pdf manuals Currently in a fab 2003 vintage.

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AMAT / APPLIED MATERIALS / AKT Endura 5500 Reactor is an advanced, cost-effective multipurpose cluster tools that provide improved performance requirements for demanding wafer fabrication processes. This reactor is capable of providing a reliable and uniform environment during the etching and deposition processes. AKT Endura 5500 Reactor is specifically designed for singles, dual and multi-chamber operations, using an advanced vacuum equipment with superior gas distribution and a variety of options. AMAT ENDURA 5500 is built with a compact design that requires minimal space and takes up less than 3 cubic meters, allowing it to fit into any production process with ease. AKT ENDURA 5500 allows for easy positioning in three dimensional directions, making it more efficient and easier to set up and run. APPLIED MATERIALS Endura 5500 also has a unique cooling system that allows for faster throughput and cooling between runs. This multi-purpose cluster tool also provides options for etching and deposition processes. Endura 5500 includes a modular etch and deposition chamber design that allows for deposition to be performed as etching takes place in the same space. This multipurpose feature ensures that a wide variety of processes are able to be completed within the one reactor. The Endura 5500Reactor provides low cost and low maintenance with excellent performance and durability. Its gas delivery unit lends itself to increased throughput and improved product yield. AMAT / APPLIED MATERIALS / AKT ENDURA 5500's high vacuum capabilities improve quality and repeatability while eliminating wafer edge effects. ENDURA 5500 comes with a wide range of control options which provides a high level of control and accuracy for both etching and deposition processes. The reactor includes both a process control machine and an operator panel for greater operator convenience. The control tool can manage multiple process parameters with quick process development, high performance and accuracy. APPLIED MATERIALS ENDURA 5500's advanced features and compact design make it the perfect choice for a number of applications. Its flexibility and easy installation allow it to be integrated into any process while providing optimized results and exceptional performance. The reactor can handle any process from etching to deposition with low cost, high repeatability, and improved throughput.