Used AMAT / APPLIED MATERIALS Endura 5500 #9048796 for sale
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ID: 9048796
CuBs SIP Encore system, 6" - 8"
Currently configured for 8"
(5) Chambers
Capabilities: Hot Al, SIP TTN, SiP Encore Cu, SIP Encore Ta(N), CleanW
Application: copper barrier seed
Interface Type: SECS RS-232
Elevator Type: Universal Manual w/Rotate
External Cooling: Water Cooled
Wide Body Load Locks: variable speed soft vent VHP transfer robot with HTHU compatible blade
HP+ buffer robot with metal blade
SMIF integrated tool control
Chamber 1: Enhanced Hot Aluminum
Standard Body Chamber
Mech. Clamped chuck, Ti clamp ring
CTI Onboard Cryo, fast regen, low vibe
Magnet type: 12.9" Al A, P/N: 0020-26822
Chamber 2: Ti Nitride
Wide Body Chamber
Elec. Chuck: Bias MCS ESC, SST cover ring
Wafer bias power supply, 13.56MHz 600 W
CTI Onboard Cryo, fast regen, low vibe
Magnet type: SIP REV2, P/N: 0010-04065
Chamber 3: SIP Encore Cu
Wide Body Chamber
Elec. Chuck: SLT FDR E-Chuck, Ti cover ring, cryo chilled
Wafer bias power supply, 13.56MHz 1250 W
CTI Onboard Cryo, fast regen, low vibe
Magnet type: LP 8.8, P/N: 0010-12864
Chamber 4: SIP Encore Ta(N)
Wide Body Chamber
Elec.Chuck: SLT FDR E-Chuck, Ti -Arc-Sp
Wafer bias power supply, 13.56MHz 600W, ICE RF Match
CTI Onboard Cryo, fast regen, low vibe
Magnet Type: Encore Rev 2, P/N:0010-14875
Chamber 5: CleanW PVD
Wide Body Chamber
Elec. Chuck: MCS+ ESC, SST-Arc-Sp cover ring
CTI Onboard Cryo, fast regen, low vibe
Magnet type: PVD WII, P/N: 0010-11925
Accessories:
(3) CTI 9600 Compressor, p/n: 3620-01389, water cooled
(3) CTI Onboard Terminal, p/n: 3620-01553
(2) Neslab System III Heat Exchanger
(1) CTL Inc subzero chiller, Model: BCU-L310F1-AMAT
(1) Toyota T100L Dry Pump
(2) Toyata T600 Dry Pump
Buffer Chamber:
Position "A": Pass thru with clear plastic lid
Position "B": Cooldown with temp monitor
Position "D": Reactive Preclean, Leybold TMP
Position "E" Orienter degas with temp feedback
Position "F" Orienter degas with temp feedback
50' cable harness
480V, 500.0A, 60Hz, 3 phase
CE marked
2007 vintage.
AKT AMAT / APPLIED MATERIALS / AKT Endura 5500 is a state-of-the-art plasma-enhanced chemical vapor deposition (PECVD) reactor designed to provide an efficient, cost-effective way to deposit thin films of silicon oxide, nitride, and other materials on substrates of various sizes. AKT Endura 5500 enables process engineers in the semiconductor, flat panel display, optical, and photovoltaic industries to deliver superior process uniformity, repeatability, and high-throughput fabrication capabilities. AMAT ENDURA 5500 provides a top-tier, high-productivity deposition process that excels at scaling beyond traditional product limits. Its sub-nano thin film coating capabilities, as well as its unique plasma-enhanced deposition technology, enable engineers to optimize film uniformity without sacrificing throughput. AMAT / APPLIED MATERIALS / AKT ENDURA 5500's compact footprint and low installation costs afford process engineers opportunity to save valuable floor space while achieving targeted performance criteria. The centerpiece of ENDURA 5500's architecture is the proprietary Process Monitoring System (PMS), a proprietary monitoring suite that can monitor process conditions such as process pressure, ion energy, temperature, and film composition. This system also features closed- loop feedback control capabilities, assuring process stability to produce uniform and repeatable performance time after time. The robust manufacturing capabilities of APPLIED MATERIALS ENDURA 5500 are enabled by its innovative design - premium components, cutting-edge materials, and superior production precision with clear attention to detail. Its dual-chamber reactor source is designed for a variety of substrate configurations, and its gas management system allows for reliable, uniform process control. The optional integrated power supply produces a maximum power of 13 MHz at up to 1000-Watts with minimum de-tuning/drift, assuring optimal power uniformity and minimal power and component degradation. The advanced features and steep technical scalability of Endura 5500 make it a top choice amongst advanced, high-volume process engineers. Its advanced technologies and top-tier performance capacity enable the deposition of films with superior uniformity and repeatability at nanosheet thickness levels, making it the best choice for high-demand, multi-material deposition processes. All in all, APPLIED MATERIALS Endura 5500 is an advanced PECVD reactor designed to deliver cost-efficient, repeatable, and reliable processing capabilities for a wide range of semiconductor, flat panel display, optical and photovoltaic applications.
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